High Frequency Module Inductor Capacitor Layout
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Solution Overview
Problem
In high frequency modules, the miniaturization of components leads to a reduction in the distance between inductor and capacitor conductor patterns, causing the magnetic field from the inductor to be blocked by the capacitor, resulting in a deterioration of the Q value and circuit characteristics.
Innovation Solution
The inductor and capacitor conductor patterns are positioned such that the flat-plate conductors of the capacitor are placed away from the air core portion of the inductor, preventing magnetic field interference and maintaining the Q value of the inductor, with the capacitor patterns also being arranged perpendicular to the stacking direction to avoid blocking the magnetic field.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the spacing between inductor and capacitor conductor patterns is narrowed for miniaturization, then the module size is reduced, but the Q value of the inductor deteriorates due to magnetic field blocking
Solution Approach 1:
The patent repositions the capacitor conductor patterns from a configuration where they face the inductor conductor patterns in the stacking direction to a configuration where they extend in the stacking direction perpendicular to the inductor's magnetic field. This dimensional reorientation allows the capacitor to maintain its capacitance function while avoiding magnetic field interference, thus preserving the inductor's Q value even in miniaturized modules.
Solution Approach 2:
The patent applies different spatial orientations to different conductor patterns based on their functional requirements. The inductor conductor patterns are configured to generate magnetic field in a specific direction, while the capacitor conductor patterns are oriented perpendicular to this direction. This localized differentiation of spatial quality allows both components to coexist in close proximity without mutual interference.
2Length of stationary object
If the distance between inductor conductor patterns and capacitor conductor patterns is shortened, then miniaturization is achieved, but magnetic field interference occurs causing circuit characteristic degradation
Solution Approach 1:
The patent transforms the potential harmful effect of close spacing into a beneficial arrangement by orienting the capacitor conductor patterns perpendicular to the inductor's magnetic field direction. This conversion allows the close spacing to be maintained for miniaturization while the perpendicular orientation ensures that the capacitor does not block or interfere with the magnetic field, thus eliminating the harmful effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the degradation of the inductor's Q value and improves the circuit characteristics by preventing magnetic field interference, allowing for better performance even in reduced module sizes.
Implementation Method 1
an inductor, aligned in a stacking direction of the insulator layers, that includes inductor conductor patterns
Implementation Method 2
a capacitor that includes capacitor conductor patterns, including at least one pair of flat-plate conductors provided in different ones of the insulator layers
Data Source
AI summary
A multilayered high frequency module includes inductor conductor patterns each defined by a linear conductor having a coiled shape on intermediate insulator layers of a multilayer body. A first spiral inductor with its axis extending in the stacking direction is defined by the inductor conductor patterns on respective layers connected through conductive via holes. Overlapped portions of inner regions of the individual inductor conductor patterns within the coiled shape define an air core portion of the first inductor. A capacitor conductor pattern is provided on one layer lower than the insulator layers on which the inductor conductor patterns are provided. The capacitor conductor pattern is a flat plate and located at a position not overlapping with the air core portion when looking at the multilayer body in a plan view.