High-Frequency Module Inductor Layout for Signal Leakage Reduction
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Solution Overview
Problem
High-frequency modules face signal interference issues due to increased components and wiring patterns, leading to reduced reception sensitivity as high-frequency transmission signals leak from power amplifier circuits to reception circuits, causing electromagnetic field coupling and noise increase.
Innovation Solution
The high-frequency module incorporates a branching circuit with a first matching network featuring multiple inductors connected in series, and a second matching network with a chip inductor for impedance matching, reducing electromagnetic field coupling by varying the number of turns, distance, and winding direction of inductors, and positioning them to intersect or be at right angles, thereby minimizing signal leakage and noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If high-frequency components are discretely mounted on substrate surface, then assembly flexibility is improved, but module size increases and cost increases
Solution Approach 1:
The patent combines multiple discrete high-frequency components (power amplifier, duplexer, matching networks) into an integrated substrate structure where components are built-in rather than separately mounted. This merging approach reduces the overall module size while maintaining functional performance by eliminating discrete mounting requirements.
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: it serves as the mounting platform, the circuit board, the housing structure, and the integration medium for all high-frequency components. This multi-functionality eliminates the need for separate discrete components and reduces overall module size.
2Area of stationary object
If components are built-in to substrate, then miniaturization is improved, but signal interference increases due to electromagnetic field coupling
Solution Approach 1:
The patent introduces a ground structure as an intermediary element between the power amplifier circuit and the duplexer. This ground structure acts as a shield that blocks electromagnetic field coupling and signal interference while allowing the components to be closely integrated on the substrate for miniaturization.
Solution Approach 2:
The substrate is divided into distinct functional regions with clear separation between the power amplifier circuit area and the duplexer area. This segmentation reduces electromagnetic interference by creating spatial isolation between high-power transmission circuits and sensitive reception circuits, while still maintaining overall compact integration.
3Power
If power amplifier circuit handles high-power transmission signal, then transmission capability is improved, but leakage to reception circuit increases reducing sensitivity
Solution Approach 1:
The ground structure serves as a protective intermediary between the high-power power amplifier circuit and the sensitive duplexer/reception circuit. It blocks the leakage of high-frequency transmission signals and harmonic components, preventing them from interfering with reception signals and maintaining high reception sensitivity.
Solution Approach 2:
The patent applies different design characteristics to different regions: the power amplifier region is designed for high-power handling with appropriate grounding, while the duplexer region is designed for signal sensitivity with shielding protection. This local differentiation allows high transmission power in one area without compromising reception sensitivity in another area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses signal leakage and noise, enhancing the reception sensitivity of the high-frequency module by reducing electromagnetic field coupling and allowing for miniaturization while maintaining effective impedance matching.
Implementation Method 1
the first inductor and the second inductor may be coupled via an electromagnetic field
Data Source
AI summary
A front-end circuit (1), which is a high-frequency module, includes an input-output terminal (4); a duplexer (14) electrically connected to the input-output terminal (4); an LNA (171) electrically connected to the duplexer (14); a PA (161) electrically connected to the duplexer (14); a matching network (23) provided between the input-output terminal (4) and the duplexer (14) and including an inductor (231); and a matching network provided between the duplexer (14) and the PA (161) and including an inductor (162). The matching network including the inductor (162) is an output matching network configured to perform impedance matching between an output terminal of the PA (161) and the duplexer (14), and the inductor (231) includes a plurality of inductors (231a and 231b) connected in series.