High-frequency module visual inspection impedance adjustment

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Solution Overview

Problem

Existing high-frequency modules face challenges in accurately checking the connection state between non-reciprocal circuit elements and substrate wiring, adjusting impedance, and preventing tilting during mounting due to variations in terminal thickness and solder application.

Innovation Solution

The non-reciprocal circuit element is mounted on a substrate with input, output, and ground terminals on side surfaces perpendicular to the main surfaces, allowing visual inspection and easy impedance adjustment via connection members, which also ensures balanced mounting and reduces direct-current magnetic field interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the non-reciprocal circuit element is mounted with terminals facing the substrate for connection, then the connection can be made, but the connection state cannot be visually checked and impedance adjustment is difficult

Engineering Contradiction:
Improveconnection state inspectionVSAvoidconnection state visibility
Core Design Contradiction:
Ease of manufactureVSDifficulty of detecting and measuring

Solution Approach 1:

The terminals are moved from the bottom end surface to the side surface of the ferrite, changing the mounting orientation from vertical to horizontal. This dimensional change allows the connection state to be visually inspected from the side while maintaining electrical connection functionality through the connection member extending from the side surface to the substrate.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If solder is applied to terminals with thickness variations, then mounting is possible, but tilting occurs and connection defects happen

Engineering Contradiction:
Improvemounting processVSAvoidmounting alignment
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The connection member is pre-formed with a specific structure including a first portion connected to the terminal and a second portion extending to the substrate. This preliminary preparation of the connection member compensates for terminal thickness variations and prevents tilting during mounting, as the connection member's structure ensures proper alignment and support.

Inventive Principle:
Principle #10Preliminary action

3Volume of moving object

If the non-reciprocal circuit element is mounted without a yoke to reduce size, then the module becomes compact, but the mounting stability decreases

Engineering Contradiction:
Improvemodule sizeVSAvoidmounting stability
Core Design Contradiction:
Volume of moving objectVSStability of the object's composition

Solution Approach 1:

The mounting structure is segmented into multiple components: the non-reciprocal circuit element, the connection member with distinct portions, and the substrate with mounting electrodes. This segmentation allows the connection member to provide both electrical connection and mechanical support functions, maintaining stability without requiring a large yoke structure.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Facilitates easy visual inspection of connection states, allows for precise impedance adjustment, prevents tilting, and reduces magnetic field effects, enhancing the reliability and compactness of high-frequency modules.

Implementation Method 1

a pair of permanent magnets that are arranged at the two main surfaces so as to apply a direct-current magnetic field to the ferrite

Methodology Applied
Scientific EffectDirect-current magnetic field: Magnetic Field

Implementation Method 2

the terminals 105 to 107 provided on the lower end surface of ferrite 101 face the substrate 2 and are respectively connected to the mounting electrodes 2a to 2c of the substrate 2 via solder

Methodology Applied
Scientific EffectSoldering: Soldering

Data Source

PatentUS8692628B2High-frequency module
Publication Date: 2014.04.08 MURATA MFG CO LTD
  • US8692628B2 patent drawing
  • US8692628B2 patent drawing
  • US8692628B2 patent drawing

AI summary

In a high-frequency module, an input terminal, an output terminal and a ground terminal, which are arranged so as to be capable of being visually checked, and wiring line electrodes located on a mounting surface are electrically connected to each other by wires and therefore the connection state of a non-reciprocal circuit element to the wiring line electrodes on the mounting surface of the substrate can be easily visually checked and an impedance adjustment between the non-reciprocal circuit element and the wiring line electrodes located on the mounting surface of the substrate on which the non-reciprocal circuit element is mounted or electronic components mounted on the mounting surface can be easily performed by adjusting the lengths of the wires.