High-Frequency Module Lamination for Compact RF Design
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Solution Overview
Problem
Conventional high-frequency modules experience upsizing and increased profile due to the arrangement of high-frequency circuit components on substrates, leading to performance degradation from unwanted radiation, especially when power amplifiers are involved.
Innovation Solution
A high-frequency module design featuring a lamination configuration of substrates with internal high-frequency circuit components, including a power amplifier, and the use of conductor layers and members to confine and ground electromagnetic radiation, preventing unwanted radiation effects and enabling downsizing while maintaining performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-frequency circuit components are arranged on the substrate of the first radio frequency package, then the functionality and performance of the high-frequency module is improved, but the module size and profile increase
Solution Approach 1:
The patent transitions from planar arrangement of high-frequency components on a single substrate to a three-dimensional stacked configuration where components are distributed across multiple substrates (first and second radio frequency packages) in vertical layers. This dimensional change allows compact integration while maintaining component functionality.
Solution Approach 2:
The patent embeds the first radio frequency package containing high-frequency amplifier elements within or alongside the second radio frequency package, creating a nested or interleaved structure. This nesting approach maximizes space utilization and reduces overall module footprint.
2Power
If high-frequency amplifier elements are arranged on the substrate, then the amplification functionality is achieved, but unwanted radiation increases causing performance degradation
Solution Approach 1:
The patent extracts high-frequency amplifier elements from the conventional planar substrate arrangement and relocates them to specific positions on the first radio frequency package substrate, separating them from other circuit components. This extraction reduces electromagnetic interference and unwanted radiation effects on surrounding components.
Solution Approach 2:
The patent introduces grounding structures and shielding configurations as intermediary elements between high-frequency amplifier elements and other circuit components. These intermediaries act as electromagnetic barriers that contain unwanted radiation while allowing the amplification function to operate effectively.
3Area of stationary object
If multiple substrates are laminated vertically, then the profile and area are reduced, but the complexity of assembly and alignment increases
Solution Approach 1:
The patent divides the radio frequency module into segmented functional packages (first and second radio frequency packages), each handling specific functions. This segmentation allows independent fabrication and testing of each package before final assembly, reducing overall system complexity despite the multi-layer structure.
Solution Approach 2:
The patent designs the lamination structure with universal mounting interfaces and standardized connection protocols that enable flexible assembly of different package combinations. This multi-functionality approach simplifies the assembly process by providing standardized mechanisms for aligning and connecting multiple substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the module's profile and prevents performance degradation by internalizing high-frequency components and using conductor layers to manage radiation, ensuring efficient operation and compact design.
Implementation Method 1
the use of conductor layers and members to confine and ground electromagnetic radiation, preventing unwanted radiation effects
Data Source
AI summary
A high-frequency module (1) includes a first substrate (101), a second substrate (102) that faces the first substrate (101), a support (103) that supports the first substrate (101) and the second substrate (102), and a plurality of high-frequency circuit components arranged in internal space formed by the first substrate (101), the second substrate (102), and the support and on both of facing principal faces of the first substrate (101) and the second substrate (102), and the plurality of high-frequency circuit components include a power amplifier element that constitutes a power amplifier circuit (16).