High-frequency Module Coupling Inhibition via Intermediary Resistor
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Solution Overview
Problem
High-frequency modules implementing carrier aggregation face reduced isolation characteristics due to harmonic leakage from low-band transmission signals to high-band reception circuits, exacerbated by electromagnetic and capacitive coupling between elements and transmission lines.
Innovation Solution
Incorporating a coupling inhibition element, such as a 0-ohm chip resistor, between the duplexer circuit of the high-band and the amplifier circuit of the low-band, which is electrically isolated and connected to the substrate ground via a via conductor, to reduce coupling and harmonic leakage, while allowing flexibility in substrate layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If elements are disposed far apart to reduce coupling, then isolation characteristics are improved, but substrate layout flexibility is reduced
Solution Approach 1:
A coupling inhibition element is introduced as an intermediary component between the amplifier circuit and duplexer circuit. This element actively reduces electromagnetic coupling and harmonic leakage without requiring increased physical separation, thereby maintaining both isolation characteristics and layout flexibility.
Solution Approach 2:
The coupling inhibition element operates in the electromagnetic field dimension rather than relying solely on physical spatial separation. By introducing this functional element, the patent solves the coupling problem through field control rather than geometric arrangement, preserving layout flexibility.
2Reliability
If matching circuit is connected to ground terminal without substrate ground pattern connection, then harmonic leakage through ground pattern is reduced, but other coupling paths remain
Solution Approach 1:
The coupling inhibition element serves as an additional intermediary that specifically targets and reduces coupling through alternative paths (electromagnetic field coupling and capacitive coupling) that were not addressed by the ground pattern disconnection alone.
Solution Approach 2:
The coupling inhibition element is positioned to preemptively reduce coupling effects before they can significantly impact the reception circuit, countering the harmful coupling paths that exist despite ground pattern disconnection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes harmonic leakage, maintaining isolation characteristics across bands and enabling flexible substrate design without affecting signal transmission and reception.
Implementation Method 1
paths formed by coupling (electromagnetic field coupling and capacitive coupling) occurring between elements and between transmission lines
Implementation Method 2
paths formed by coupling (electromagnetic field coupling and capacitive coupling) occurring between elements and between transmission lines
Data Source
AI summary
On a substrate (200), a resistor (24R) is disposed between a position of an amplifier circuit (11) and a position of a duplexer (24), thereby reducing coupling occurring in a space between the amplifier circuit (11) and a path extending from a main switch (26) to a reception terminal (P24) through the duplexer (24). Even when an RX terminal (242) of the duplexer (24) is oriented toward an amplifier circuit (11) side, a high-frequency module (100) reduces the coupling and can thus prevent a harmonic of a transmission signal in a low band from leaking to the reception terminal (P24) through a path formed by the coupling. That is, the high-frequency module (100) can prevent a reduction in isolation characteristics in the low band and a high band and also provide flexibility in substrate layout.