High Frequency Module Selective Shielding
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Solution Overview
Problem
In high frequency modules, providing a shield for specific components restricts their arrangement flexibility and can lead to reduced shielding effectiveness due to the need for components to be positioned near the side shield plate.
Innovation Solution
A high frequency module design featuring a shield member surrounding the first component within the sealing resin layer and a shield film on the resin layer's surface, with one end of the shield member connected to the shield film and the other to an electrode on the wiring substrate, allowing selective shielding of specific components without restricting their arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a side shield plate is used to shield specific components, then shielding effectiveness is improved, but component arrangement flexibility is reduced
Solution Approach 1:
The shield is divided into two independent parts: a side shield plate extending from the substrate and a shield film formed on the sealing resin layer. This segmentation allows the shield film to be selectively applied to specific components without requiring all components to be positioned near the side shield plate, thus maintaining arrangement flexibility while achieving effective shielding for targeted components.
Solution Approach 2:
The shield film is selectively formed to cover only specific components that require shielding, rather than providing uniform shielding across all components. This local quality approach allows different regions of the sealing resin layer to have different shielding properties, enabling flexible component arrangement while providing targeted shielding effectiveness where needed.
2Device complexity
If a shield is provided only for specific components, then shielding resources are optimized, but component arrangement is restricted
Solution Approach 1:
The shield film serves multiple functions: it provides shielding for specific components, maintains the sealing integrity of the resin layer, and can be configured in various patterns to accommodate different component arrangements. This multi-functionality allows the same shield film structure to adapt to different shielding needs without increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances shielding characteristics for the first component by blocking external noise and preventing mutual interference while maintaining flexibility in component placement, as the second component is not shielded, and additional components can be shielded collectively.
Implementation Method 1
a shield member that is so provided as to surround the first component when viewed from a direction perpendicular to the one main surface of the wiring substrate, and is disposed between the first component and the second component within the sealing resin layer
Implementation Method 2
a shield film formed on a surface of the sealing resin layer, wherein the sealing resin layer includes a contact surface in contact with the one main surface of the wiring substrate and an opposing surface opposing the contact surface; the shield film is so formed as to cover a portion of the opposing surface of the sealing resin layer that overlaps the first component
Implementation Method 3
one end of the shield member in a thickness direction (a direction perpendicular to the one main surface of the wiring substrate) of the sealing resin layer is exposed from the opposing surface of the sealing resin layer to be connected to the shield film, and the other end thereof in the thickness direction of the sealing resin layer is exposed from the contact surface of the sealing resin layer to be connected to an electrode formed on the one main surface of the wiring substrate
Data Source
AI summary
A high frequency module includes a plurality of components on an upper surface of a multilayer wiring substrate, a sealing resin layer on the upper surface of the multilayer wiring substrate, a shield wall surrounding one of the components within the sealing resin layer, and a shield film on an upper surface of the sealing resin layer. The shield film covers a portion of the upper surface of the sealing resin layer that overlaps the one of the components but not the other components viewed from a direction perpendicular to the upper surface of the multilayer wiring substrate. An upper end of the shield wall is exposed from the upper surface of the sealing resin layer to be connected to the shield film, and a lower end thereof is exposed from a lower surface of the sealing resin layer to be connected to the multilayer wiring substrate.