High-Frequency Module Shield Plate Isolation
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Solution Overview
Problem
High-frequency modules in mobile communication devices face signal quality deterioration due to electromagnetic coupling between circuit components, leading to reduced isolation and increased harmonic interference, and the visibility of engraved marks becomes challenging with miniaturization.
Innovation Solution
A high-frequency module design featuring a module substrate with circuit components, a resin member, a metal shield layer, and a metal shield plate that suppresses electromagnetic coupling and ensures the engraved mark's visibility by positioning the mark outside the metal shield plate's upper end surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If circuit components are arranged closely on the module substrate to achieve miniaturization, then the module size is reduced, but electromagnetic coupling between components increases causing signal quality deterioration
Solution Approach 1:
A metal shield plate is introduced as an intermediary element positioned between the transmission path circuit component and reception path circuit component. This shield plate creates electromagnetic isolation by reflecting or absorbing electromagnetic fields, preventing harmful coupling while allowing the components to remain in close proximity for miniaturization.
Solution Approach 2:
The module substrate is segmented into distinct transmission and reception regions by the metal shield plate. This segmentation separates the electromagnetic environments of different circuit paths, allowing independent optimization of each path while maintaining overall compactness.
2Ease of manufacture
If an engraved mark is provided on the resin member surface for identification, then the module can be easily identified, but the visibility is reduced when the mark overlaps with the metal shield plate structure
Solution Approach 1:
The design transitions from a two-dimensional surface marking problem to a three-dimensional spatial arrangement solution. By positioning the engraved mark in a specific location that does not overlap with the metal shield plate's upper end surface, the mark achieves visibility while the shield plate maintains its electromagnetic isolation function.
3Reliability
If a metal shield plate is added to suppress electromagnetic coupling, then signal quality is improved, but the device complexity increases
Solution Approach 1:
The metal shield plate is designed as a thin planar structure rather than a bulky three-dimensional shield. This thin-film approach provides effective electromagnetic isolation while minimizing the added volume and structural complexity. The shield plate can be integrated into the existing module substrate layout without requiring complex mounting structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances signal quality by reducing electromagnetic coupling and maintains high visibility of engraved marks, even in miniaturized modules, by using a metal shield plate to isolate circuit components and ensuring the mark does not overlap with the shield plate's upper surface.
Implementation Method 1
a metal shield plate arranged on the main surface and between the first circuit component and the second circuit component... the metal shield plate is in contact with the metal shield layer
Data Source
AI summary
A high-frequency module includes a module substrate having a main surface, a first circuit component and a second circuit component arranged on the main surface, a resin member covering at least a part of the main surface, the first circuit component and the second circuit component, a metal shield layer covering at least an upper surface of the resin member, and a metal shield plate arranged on the main surface and between the first circuit component and the second circuit component when the main surface is viewed in a plan view. The metal shield plate is in contact with the metal shield layer. An engraved mark portion indicating predetermined information is provided on the upper surface of the resin member. The engraved mark portion does not overlap at least an upper end surface of the metal shield plate when the main surface is viewed in a plan view.