High-frequency Module Shield Conductor Terminal Isolation

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Solution Overview

Problem

High-frequency modules with multilayer substrates and surface mount elements often fail to achieve sufficient isolation between terminals, leading to leakage signals and inadequate signal suppression.

Innovation Solution

Incorporating a shield conductor on the multilayer substrate, capacitively coupling the surface mount elements to the shield conductor, and adjusting the phase of the signals to ensure a phase difference greater than 90° and less than or equal to 180° between the signals passing through the terminals, effectively reducing or canceling leakage signals.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a multilayer substrate with surface mount elements is used to form a high-frequency module, then the module structure is simplified and manufacturing is easier, but the isolation between terminals deteriorates and leakage signals cannot be sufficiently suppressed

Engineering Contradiction:
Improvemodule assemblyVSAvoidterminal isolation
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

A shield conductor is introduced as an intermediary element between the surface mount element and the ground. The shield conductor is positioned at a specific distance from the surface mount element to create capacitive coupling, which generates a correction signal that suppresses leakage signals and improves terminal isolation while maintaining the simplified multilayer substrate structure

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes physical parameters including the distance between the shield conductor and surface mount element, the capacitance value of the correction capacitor, and the phase relationship between signals. By adjusting these parameters, the correction signal is optimized to achieve maximum leakage suppression while maintaining ease of manufacture

Inventive Principle:
Principle #35Parameter changes

2Reliability

If correction capacitors are added to suppress leakage signals, then terminal isolation improves, but the device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improveterminal isolationVSAvoidcircuit structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The shield conductor serves multiple functions: it acts as a shielding element, creates capacitive coupling for signal correction, and provides a reference ground. This multi-functionality reduces the need for additional dedicated correction components, thereby improving terminal isolation without proportionally increasing device complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly improves the isolation between terminals by reducing or preventing signals in specific frequency bands, enhancing the overall performance of high-frequency modules.

Implementation Method 1

the first mounting terminal and the second mounting terminal are capacitively coupled to the shield conductor

Methodology Applied
Scientific EffectCapacitive coupling: Capacitance

Implementation Method 2

a signal in at least a portion of a frequency band of the first signal is canceled by the second signal at the first mounting terminal

Methodology Applied
Scientific EffectSignal cancellation through phase difference: Interference

Data Source

PatentUS10383210B2High-frequency module
Publication Date: 2019.08.13 MURATA MFG CO LTD
  • US10383210B2 patent drawing
  • US10383210B2 patent drawing
  • US10383210B2 patent drawing

AI summary

A high-frequency module includes a branching circuit element, a multilayer substrate, and a shield conductor. The branching circuit element includes transmission and receiving terminals and is disposed on a surface of the multilayer substrate. The shield conductor is disposed on the side of the surface of the multilayer substrate and covers the branching circuit element. The transmission and receiving terminals are disposed with respect to the shield conductor such that a signal in at least a portion of the frequency band of a first signal, which is transmitted from the transmission terminal, is cancelled by a second signal at the receiving terminal.