High-frequency module shield layers for height reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-frequency modules with metal shield layers face challenges in achieving desired shield characteristics while maintaining a reduced height, as existing shield layers have low adhesive strength and anti-corrosiveness, and deposition methods result in uneven thickness, obstructing module height reduction.
Innovation Solution
A high-frequency module design featuring a first shield layer laminated on the sealing resin layer's opposite and peripheral surfaces, with a second shield layer reinforcing the peripheral side surface, allowing for optimized thickness distribution and reduced module height while ensuring shield characteristics, using a sputtering method to form layers with specific metal compositions and structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal shield layer is deposited on the mold resin surface to intercept electromagnetic waves, then shield characteristics are improved, but adhesive strength and anti-corrosiveness deteriorate
Solution Approach 1:
The patent applies composite material structure by combining multiple film layers (adhesion film, conductive film, protective film) to create a shield layer that simultaneously achieves electromagnetic wave interception, strong adhesion to mold resin, and corrosion resistance. Each layer contributes specific properties that collectively resolve the contradiction between shield characteristics and reliability.
Solution Approach 2:
The patent introduces an adhesion film as an intermediary layer between the mold resin and the conductive shield layer. This intermediary layer specifically addresses the adhesion problem by providing a surface that bonds well to both the resin substrate and the metal conductive film, thereby resolving the low adhesive strength issue while maintaining shield effectiveness.
2Object-affected harmful factors
If the shield layer thickness is increased on the peripheral side surface to obtain desired shield characteristics, then shield effectiveness is improved, but module height increases
Solution Approach 1:
The patent applies local quality by creating non-uniform film thickness distribution across different regions of the shield layer. The deposition process is controlled to provide thicker film coverage on peripheral side surfaces where shielding is most critical, while maintaining thinner coverage on top surfaces, thereby achieving effective shielding without proportionally increasing overall module height.
Solution Approach 2:
The patent transitions from considering only vertical thickness to utilizing three-dimensional spatial distribution of film thickness. By controlling deposition angles and source positioning, the shield layer achieves optimized thickness in multiple dimensions - thicker at peripheral edges and thinner at central top areas - resolving the contradiction between shielding effectiveness and height reduction.
3Reliability
If a three-layer shield structure with adhesion film, conductive film, and protective film is formed, then adhesive strength and anti-corrosiveness are improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functional requirements (adhesion, conductivity, corrosion protection) into a single integrated shield layer structure. By combining these functions into one multi-layer component deposited in sequence, the patent achieves high reliability without proportionally increasing device complexity, as the layers work together as a unified system rather than separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module achieves reduced height with enhanced shield characteristics by distributing thickness effectively between the first and second shield layers, improving adhesive strength and anti-corrosiveness, and reducing peeling due to similar thermal expansion coefficients.
Implementation Method 1
using a sputtering method to form layers with specific metal compositions and structures
Data Source
AI summary
A high-frequency module includes a wiring board, a component that is mounted on an upper surface of the wiring board, a sealing resin layer that is laminated on the upper surface of the wiring board and that seals the component, a first shield layer that is laminated on the sealing resin layer so as to cover an opposite surface of the sealing resin layer and a peripheral side surface of the sealing resin layer, the opposite surface being opposite to the upper surface of the wiring board, and a second shield layer that is laminated on a portion of the first shield layer that covers the peripheral side surface of the sealing resin layer. In this case, even if the first shield layer cannot be made thick enough for obtaining desired shield characteristics, the second shield layer can provide a thickness corresponding to the insufficient thickness.