High-frequency Module Shield Member Design

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Solution Overview

Problem

Existing high-frequency modules face challenges in designing component arrangements due to the risk of damaging wiring boards during groove formation for shield creation and limited design freedom, especially when using conductive resin in grooves formed by laser processing.

Innovation Solution

Incorporating a shield member composed of metal pins arranged parallel to the wiring board surface between components, allowing for improved conductivity and flexibility in design without damaging the wiring board, and enabling easier connection between the board and pins.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a groove is formed in the sealing resin layer by laser processing to create a shield portion, then shield characteristics between components are improved, but the wiring board may be damaged by laser irradiation

Engineering Contradiction:

Improveshield characteristicsVSAvoidwiring board damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The invention extracts the shield-forming process from the sealing resin layer and relocates it to the wiring board surface. Instead of forming grooves in the resin layer, the patent forms shield portions directly on the wiring board using conductive resin, thereby eliminating the harmful laser irradiation to the wiring board while maintaining the shielding function.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention introduces conductive resin as an intermediary material to form the shield portions. The conductive resin is applied to the wiring board surface in groove-like patterns to create shield portions that prevent noise interference, serving as a mediator between the wiring board and the sealing resin layer without requiring laser processing of the resin layer.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If components are arranged away from the groove to protect them from laser impact, then component protection is improved, but design freedom and compactness deteriorate

Engineering Contradiction:

Improvecomponent protectionVSAvoiddesign freedom

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The invention extracts the shield function from the sealing resin layer and implements it directly on the wiring board surface. This allows components to be arranged freely on the wiring board without needing to maintain distance from shield grooves in the resin layer, thereby improving design freedom and enabling more compact arrangements.

Inventive Principle:

Principle #2Taking out (Extraction)

3Ease of manufacture

If the groove cross section is formed in a tapered shape to facilitate conductive resin filling, then ease of manufacture is improved, but device complexity and design freedom increase

Engineering Contradiction:

Improveconductive resin fillingVSAvoidgroove structure

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

Instead of forming complex tapered grooves in the sealing resin layer to facilitate resin filling, the invention inverts the approach by forming simple groove-like patterns directly on the wiring board surface and filling them with conductive resin. This simplifies the overall structure while maintaining ease of manufacture.

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances shield characteristics, reduces connection resistance, and increases design freedom by eliminating the need for groove formation, allowing for more efficient component arrangement and shielding without damaging the wiring board.

Implementation Method 1

the shield member includes a metal pin arranged such that a length direction is substantially parallel to the main surface of the wiring board

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11602089B2High-frequency module

Publication Date: 2023.03.07 MURATA MFG CO LTD

AI summary

In a high-frequency module provided with a shield member between components, improvement in the degree of freedom in design such as arrangement of components or the like is achieved while preventing damage to a wiring board. A high-frequency module (1a) includes a multilayer wiring board (2), a plurality of components (3a) and (3b) mounted on an upper surface (20a) of the multilayer wiring board (2), and a shield member (5) for shielding between the component (3a) and the component (3b), in which the shield member (5) is formed in a flat plate shape, with a plurality of metal pins (5a) each stacked in a thickness direction of the sealing resin layer (4) such that a length direction is made to be substantially parallel to the upper surface (20a) of the multilayer wiring board (2), and a resin molded portion (5b) for fixing the metal pins (5a).