High Frequency Module Shield with Openings for Interference Reduction

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Solution Overview

Problem

High frequency signals in double-tuner receivers experience interference due to electromagnetic field spurious noise, particularly in the gigahertz band, as a result of the close proximity of satellite and terrestrial tuners, leading to increased module size and cost due to the need for larger capacitance and chip size to prevent resonance and radiation issues.

Innovation Solution

A high frequency module with integrated circuits for satellite and terrestrial tuners, where the shield case has openings equal to or larger than half the size of the ICs, allowing for the efficient exhaustion of electric and magnetic fields outside the shield, thereby preventing stray capacitance and allowing closer component arrangement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a shield case is used to cover the ICs to prevent electromagnetic interference, then interference between tuners is reduced, but the module size increases and component arrangement flexibility is limited

Engineering Contradiction:
Improveelectromagnetic interferenceVSAvoidmodule size
Core Design Contradiction:
Object-affected harmful factorsVSVolume of moving object

Solution Approach 1:

The shield case is segmented by forming openings (through-holes) in specific regions. This segmentation allows the shield to maintain its protective function while creating pathways for electromagnetic field exhaustion, effectively reducing interference without requiring a completely enclosed large shield structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The openings in the shield case act as intermediaries that allow electromagnetic fields to escape from the interior to the exterior. This mediator approach enables the shield to selectively block harmful interference while permitting controlled field exhaustion, resolving the contradiction between protection and size.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If larger capacitance and chip size are used to prevent resonance and radiation issues, then electromagnetic interference is reduced, but manufacturing cost increases

Engineering Contradiction:
Improveelectromagnetic interferenceVSAvoidmanufacturing cost
Core Design Contradiction:
Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The harmful electromagnetic fields are extracted from the enclosed space by providing openings in the shield case. This extraction approach prevents resonance and radiation issues without requiring larger capacitance values or oversized chips, thereby avoiding increased manufacturing costs.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The shield case structure is modified by changing its parameter from a fully enclosed form to one with openings. This parameter change allows electromagnetic fields to be exhausted properly, preventing resonance issues without requiring changes to component specifications that would increase cost.

Inventive Principle:
Principle #35Parameter changes

3Volume of moving object

If multiple ICs with local oscillators are arranged closely to downsize the module, then integration is improved, but electromagnetic field interference between ICs increases

Engineering Contradiction:
Improvemodule sizeVSAvoidelectromagnetic field interference
Core Design Contradiction:
Volume of moving objectVSObject-generated harmful factors

Solution Approach 1:

The problem of close IC arrangement is solved by adding a vertical dimension consideration - the shield case with openings provides a three-dimensional solution space. This allows ICs to be arranged closely in the planar dimension while the shield structure manages electromagnetic fields in the vertical dimension through controlled exhaustion paths.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The electromagnetic fields generated by closely arranged ICs are converted from harmful interference into controlled field exhaustion through the openings. The openings provide designated pathways for field escape, transforming potential interference into a controlled phenomenon that does not degrade system performance.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces electromagnetic interference between tuners, enabling a downsized module design while maintaining efficient frequency conversion and signal integrity, as demonstrated by reduced bit error rates and improved carrier-to-noise ratios.

Implementation Method 1

an electric field and a magnetic field induced from the inductor are radiated in the vertically direction on the sheet during the IC operation

Methodology Applied
Scientific EffectElectromagnetic field radiation: Electromagnetic Induction

Implementation Method 2

a shield case 14 so that a thin module is configured... effectively reduces electromagnetic interference between tuners

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS8923748B2High frequency module and receiver
Publication Date: 2014.12.30 SATURN LICENSING LLC
  • US8923748B2 patent drawing
  • US8923748B2 patent drawing
  • US8923748B2 patent drawing

AI summary

There are provided a high frequency module and a receiver capable of exhausting an electric field and a magnetic field to the outside of a shield, more closely arranging electronic components inside the shield, and being downsized. The high frequency module has integrated circuits (IC) 112, 113 each incorporating an oscillator including an inductor, and a shield case 114 as a shield for covering the ICs 112, 113, and the shield case 114 as a shield is formed with openings 116A, 116B having a size equal to or more than half the shape size of the ICs 112, 113 in areas opposed to the arrangement positions of the ICs 112, 113.