High-frequency module shield wall design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-frequency modules face issues with cracking or warping of the wiring substrate due to heat or stress generated during use, particularly when a slit method is used for shielding between components, which can lead to electromagnetic wave interference.
Innovation Solution
A high-frequency module design featuring a shield wall with shield wall element bodies that are not exposed at the side surfaces of the sealing resin layer, partitioning the resin layer into regions to reduce substrate stress and improve shielding performance, while maintaining a continuous resin structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a groove is formed in the molding resin layer and filled with conductive paste to create a shield wall, then electromagnetic wave interference between components is prevented, but the wiring substrate may crack or warp due to heat or stress generated when the high-frequency module is used
Solution Approach 1:
The patent introduces a molding resin layer as an intermediary substance that fills the groove containing the conductive paste. This resin layer acts as a stress-absorbing medium that protects the wiring substrate from direct thermal and mechanical stress, preventing cracking and warping while maintaining the electromagnetic shielding function of the conductive paste shield wall
Solution Approach 2:
The shield wall structure combines multiple materials: conductive paste for electromagnetic shielding, molding resin for structural support and stress distribution, and adhesive for bonding. This composite structure achieves both electromagnetic interference prevention and mechanical stress resistance, resolving the contradiction between shielding performance and substrate reliability
2Object-affected harmful factors
If the molding resin layer is divided by a groove for shield wall formation, then shielding performance is improved, but the continuous structure of the resin layer is disrupted causing stress concentration
Solution Approach 1:
The patent segments the shield wall formation process: the groove is filled with conductive paste for electromagnetic shielding, while the molding resin layer is separately applied to cover and connect around the groove. This segmentation allows the resin layer to maintain its continuous load-bearing structure while the conductive paste provides the shielding function in the grooved region
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the occurrence of substrate cracking and warping while effectively preventing electromagnetic wave interference between components, enhancing the module's reliability and performance.
Implementation Method 1
a shield layer that is for preventing the electromagnetic wave interference between the components
Data Source
AI summary
A high-frequency module 1a includes: a wiring substrate 2; a plurality of components 3a and 3b that are mounted on an upper surface 2a of the wiring substrate 2; a sealing resin layer 4 that is stacked on the upper surface 2a of the wiring substrate 2; a shield film 6 that covers a surface of the sealing resin layer 4; and a shield wall 5 that is provided in the sealing resin layer 4. The shield wall 5 is formed of two shield wall element bodies 5a and 5b that have straight line shapes in a plan view, and the two shield wall element bodies 5a and 5b are arranged such that the shield wall element bodies each have one end surface that is not exposed at a different peripheral side surface 4b of the sealing resin layer 4.