High-Frequency Module Shield Wall Metal Pins
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Solution Overview
Problem
High-frequency modules face challenges in improving shield characteristics due to high resistance of conductive resin shield layers and difficulties in depositing metal in deep slits, which can damage wiring electrodes during laser processing.
Innovation Solution
Incorporating metal pins with lower specific resistance into the shield wall, which are connected to land electrodes on the wiring board, allowing for improved shield characteristics and reduced coupling resistance, and using a metal film to enhance shielding without damaging the wiring board during laser processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductive resin is used to form the shield layer, then the shield layer can be formed by filling the slit, but the specific resistance is higher than metal filler alone
Solution Approach 1:
The patent uses a composite material structure where metal pins (low resistance) are embedded in the sealing resin layer to form the shield wall, while conductive resin is used for the shield layer covering the surface. This composite approach combines the low resistance of metal with the ease of manufacturing and surface coverage of conductive resin, resolving the contradiction between manufacturability and shield effectiveness.
2Reliability
If metal is filled in the slit by film deposition technology, then the resistance of the shield layer can be lowered, but it is difficult to deposit metal onto the bottom portion of deep slits
Solution Approach 1:
The patent applies preliminary action by pre-forming metal pins that extend from the upper surface to the lower surface of the sealing resin layer before applying the conductive resin shield layer. This ensures that the metal conductive path is already in place and connected to the ground electrode, eliminating the need for difficult deep slit filling while maintaining low resistance.
3Ease of manufacture
If laser processing is used to form grooves for shield walls, then the shield wall can be formed, but the wiring electrodes may be damaged by breakage and deformation
Solution Approach 1:
The patent extracts the harmful laser processing step from the manufacturing process. Instead of using laser to form grooves that risk damaging wiring electrodes, the invention uses pre-formed metal pins that are simply embedded into the sealing resin layer, completely eliminating the risk of wiring board damage while maintaining ease of manufacture.
Data Source
AI summary
The characteristics of a shield wall that prevents the mutual interference of the noise between components are improved by lowering the resistance of the shield wall. A high-frequency module 1a includes a wiring board 2, a plurality of components 3a to 3e mounted on an upper surface 2a of the wiring board 2, a sealing resin layer 4 stacked on the upper surface 2a of the wiring board 2 to seal the components 3a to 3e, and a shield wall 5 disposed between the adjacent components in the sealing resin layer 4. A part of the shield wall 5 is constituted of metal pins 5a standing on the upper surface 2a of the wiring board 2.