High-frequency module shield walls connecting conductor
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Solution Overview
Problem
High-frequency modules with shield layers between components suffer from reduced mechanical strength and warpage due to the division of the resin layer, which can be exacerbated by laser processing used to form grooves for the shield walls.
Innovation Solution
A configuration featuring two spaced grooves in the sealing resin layer with connecting conductors that link shield walls without dividing the resin layer, enhancing mechanical strength and reducing warpage by preventing complete division of the resin layer and minimizing damage from laser processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a groove is formed in the resin layer by laser processing to create a shield wall, then noise shielding between components is improved, but the wiring substrate may be damaged causing cracks and wiring damage
Solution Approach 1:
A resin layer is introduced as an intermediary protective layer between the laser processing zone and the wiring substrate. The groove is formed in the resin layer rather than directly in the wiring substrate, allowing the shield wall to be created while the resin layer absorbs the laser energy and protects the underlying wiring substrate from thermal damage and cracking.
2Object-affected harmful factors
If the groove entirely divides the resin section into separate regions, then shield walls can be formed between components, but the mechanical strength is reduced and warpage occurs
Solution Approach 1:
The shield wall structure is segmented into two separate shield walls formed in two spaced grooves rather than a single continuous groove. The resin layer connects these two grooves, forming a bridge that maintains mechanical continuity. This segmentation allows effective noise shielding while preserving the overall structural integrity of the resin layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves mechanical strength and reduces warpage in high-frequency modules while maintaining effective noise shielding between components, minimizing damage to the wiring substrate during laser processing.
Implementation Method 1
The shield wall may be formed by, for example, forming a groove in a resin layer by laser processing
Data Source
AI summary
A high-frequency module (1a) includes a multilayer wiring substrate (2), a plurality of components (3a, 3b) mounted on an upper surface (20a) of the multilayer wiring substrate (2), a sealing resin layer (4) laminated on the upper surface (20a) of the multilayer wiring substrate (2) and sealing the plurality of components (3a, 3b), and a shield (5). The shield (5) is composed of shield walls (5a, 5b) arranged in grooves (12) and (13), respectively, formed between the first component (3a) and the second component (3b) in the sealing resin layer (4) and a connecting conductor (11) coupling both the shield walls (5a, 5b). A first region (40a) and a second region (40b) in the sealing resin layer (4) split by the shield (5) are contiguous at the location of the connecting conductor (11) as seen from a direction perpendicular to the upper surface (20a) of the multilayer wiring substrate (2).