High Frequency Module Signal Path Balancing
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Solution Overview
Problem
High frequency modules with SAW filters mounted on the top surface and external terminals on the bottom surface suffer from increased insertion loss and interference due to lengthy signal paths that detour around the substrate, and imbalance in balanced signals caused by unequal signal path lengths.
Innovation Solution
A high frequency module design with a balanced signal output element on the top surface and reception signal terminals on the bottom surface, featuring signal paths formed using through holes inside the substrate that are not exposed on the side surfaces, and position-adjusting conductor layers to equalize signal path lengths, reducing insertion loss and interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If signal paths are formed using through holes and conductor layers with terminal electrodes on side surfaces to connect SAW filter to external terminals, then connection between top surface and bottom surface is achieved, but signal path length increases and insertion loss increases
Solution Approach 1:
The patent transitions from using side surface terminal electrodes to using bottom surface terminal electrodes, changing the spatial dimension of the connection interface. This dimensional change allows signal paths to be formed entirely within the substrate layers without extending to side surfaces, thereby reducing path length and insertion loss while maintaining connection reliability
2Ease of operation
If signal paths extend to side surfaces of layered substrate for connection, then external terminals can be connected, but signal paths become susceptible to external interference
Solution Approach 1:
The patent extracts the terminal electrodes from the side surface location and relocates them to the bottom surface of the substrate. This extraction from the vulnerable side surface position eliminates exposure to external interference while preserving the connection function, as the bottom surface provides a protected interface away from external electromagnetic fields
3Reliability
If two signal paths are provided for balanced signal output, then balanced signal transmission is enabled, but path length difference causes signal imbalance
Solution Approach 1:
The patent intentionally introduces asymmetric compensation elements (such as additional conductor layers or adjusted trace lengths) in one or both signal paths to offset inherent asymmetries. This controlled asymmetry compensates for manufacturing variations and ensures equal effective path lengths, maintaining signal balance while accommodating practical manufacturing tolerances
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design minimizes signal path lengths, reduces insertion loss, and maintains signal balance, even when the distance between reception signal terminals differs from the output terminals, enhancing the module's performance and reducing external interference.
Implementation Method 1
signal paths formed using through holes inside the substrate that are not exposed on the side surfaces
Implementation Method 2
position-adjusting conductor layers to equalize signal path lengths
Data Source
AI summary
A high frequency module includes a layered substrate and an element for outputting a reception signal in a balanced state. The element includes a first and a second output terminal and is mounted on the top surface of the layered substrate. A first and a second reception signal terminal are disposed on the bottom surface of the layered substrate. The high frequency module further includes a first signal path connecting the first output terminal and the first reception signal terminal to each other, and a second signal path connecting the second output terminal and the second reception signal terminal to each other. The first and second signal paths are each formed using one or more through holes provided inside the layered substrate, and are not exposed at any side surface of the layered substrate.