High-Frequency Module Test Terminal for Power Supply Diagnosis
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Solution Overview
Problem
High-frequency IC modules in integrated high-frequency modules often malfunction due to changes in characteristics during modularization, making it difficult to identify defects in power supply circuits, leading to inefficiencies in diagnosing and improving module performance.
Innovation Solution
A high-frequency module design with a test terminal connected to the power supply circuit and an external terminal on the laminate, allowing for voltage detection without disassembly, and including components like capacitors and inductors to reduce noise and prevent coupling between voltage transmission paths and communication signal paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If high-frequency IC is modularized into integrated high-frequency module, then integration and compactness are improved, but reliability deteriorates due to characteristic changes and power supply circuit breakdown
Solution Approach 1:
The patent provides inspection methods that can be performed before final module packaging to detect power supply circuit defects early. Test terminals are provided on the module substrate to enable preliminary testing of the high-frequency IC's power supply circuit before the module is completely assembled and sealed, allowing defects to be identified and addressed before they cause reliability issues in the final product.
2Productivity
If high-frequency IC is mounted and subjected to resin molding, then manufacturing efficiency is improved, but measurement precision deteriorates due to static electricity generation and characteristic changes
Solution Approach 1:
The patent enables preliminary inspection of the high-frequency IC's power supply circuit characteristics before the resin molding process. By providing test terminals that remain accessible after mounting but before final packaging, the method allows for measurement and verification of electrical characteristics under controlled conditions, preventing characteristic changes caused by static electricity during the molding process.
Solution Approach 2:
The test terminals act as intermediaries between the high-frequency IC and external measurement equipment. These terminals provide a controlled interface for measuring power supply circuit characteristics without requiring disassembly of the module, enabling precise measurements to be taken through the module substrate while maintaining the integrity of the high-frequency IC during the molding process.
3Stability of the object's composition
If inspection is performed after module completion, then device integrity is maintained, but ease of operation deteriorates due to difficulty in identifying power supply circuit defects
Solution Approach 1:
The test terminals serve as intermediaries that provide access to the power supply circuit for inspection purposes without requiring disassembly of the module. These terminals are provided on the module substrate and connected to the power supply circuit, enabling external measurement equipment to measure voltage waveforms and identify defects while the module remains completely assembled and intact.
Solution Approach 2:
The module design includes built-in test terminals that enable self-inspection capabilities. The high-frequency module can be inspected for power supply circuit defects using external measurement equipment connected to these terminals, eliminating the need for disassembly or specialized inspection procedures. The module essentially provides its own inspection interface through the test terminals.
Data Source
AI summary
In a high-frequency module, a laminate including a plurality of dielectric layers each including an electrode pattern located thereon, and a switch element which includes a test terminal arranged to output a negative voltage applied to the switch element and which is mounted on the laminate, are integrally formed. A test external terminal for external connection which outputs a signal to the outside is provided on a back surface of the laminate. The laminate includes a voltage transmission path electrically connecting the test terminal to the test external terminal.