High-Frequency Module Heat Dissipation via Long Via Conductor
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Solution Overview
Problem
High-frequency modules in mobile communication devices face heat dissipation challenges, particularly when electronic components generate significant heat, leading to deteriorated module characteristics due to heat transfer between components on opposite surfaces of the circuit board.
Innovation Solution
A double-sided mounting type high-frequency module design featuring a mounting substrate with circuit components on both sides, long via conductors, and a metal block or columnar electrode that connects these components and external terminals, enhancing heat dissipation by creating a high thermal conductivity path perpendicular to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If electronic components are mounted on both sides of a circuit board to increase circuit element density, then the number of circuit elements is increased, but heat generated in components is transferred to components on the opposite surface through the circuit board, deteriorating module characteristics
Solution Approach 1:
The patent introduces a via conductor that extends in the vertical dimension (thickness direction) of the circuit board, creating a third-dimensional heat dissipation path. This allows heat to be conducted from components on one surface through the via conductor to the opposite surface, utilizing the Z-axis dimension rather than relying solely on two-dimensional surface mounting capabilities.
Solution Approach 2:
The via conductor acts as an intermediary element that mediates heat transfer between components on opposite surfaces of the circuit board. By introducing this intermediate conductive structure, heat is channeled through a dedicated path rather than being directly transferred through the board substrate, enabling controlled thermal management.
2Temperature
If a via conductor is used to conduct heat from components on one surface to the opposite surface, then heat dissipation is improved, but the circuit board structure becomes more complex
Solution Approach 1:
The via conductor is designed to serve multiple functions simultaneously: it provides electrical connection between circuit layers and serves as a heat dissipation path. This multi-functionality reduces the need for separate dedicated thermal management structures, thereby limiting the increase in overall device complexity while achieving improved heat dissipation.
Solution Approach 2:
The patent merges the electrical connection function and thermal conduction function into a single via conductor structure. By combining these functions, the design avoids adding separate complex thermal management components, thus improving heat dissipation while minimizing the increase in structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation performance, preventing heat transfer to other components and enhancing the reliability and efficiency of the high-frequency module, while simplifying the manufacturing process.
Implementation Method 1
a long via conductor that is connected to the first circuit component, passes through the mounting substrate, and has a substantially long shape when the mounting substrate is viewed in a plan view, and a metal block that is arranged on the second main surface side relative to the first main surface with respect to the mounting substrate and connects the long via conductor and the external connection terminal
Data Source
AI summary
A high-frequency module includes a mounting substrate having main surfaces 30a and 30b, a first circuit component mounted on the main surface 30a, a second circuit component mounted on the main surface 30b, an external connection terminal arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate, a long via conductor connected to the first circuit component, passing through the mounting substrate, and having a substantially long shape when the mounting substrate is viewed in a plan view, and a metal block arranged on the main surface 30b side relative to the main surface 30a with respect to the mounting substrate and connecting the long via conductor and the external connection terminal. When the mounting substrate is viewed in a plan view, the first circuit component overlaps the long via conductor and the metal block overlaps the long via conductor.