High Frequency Module Via Conductor Flatness and Thermal Management

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Solution Overview

Problem

The challenge is to maintain the flatness of a mounting board while enhancing the heat dissipation ability in high frequency modules, particularly in densely mounted circuit elements of mobile communication devices, where elongated-shaped vias in the wiring board lead to irregular filling and surface depression, affecting the board's flatness and stress balance.

Innovation Solution

The solution involves a high frequency module design with a mounting board featuring an elongated-shaped via conductor and insulating parts of the same material, where the connection electrode and via conductor overlap partially, and an insulating part is placed inside the via conductor to ensure uniform filling and prevent surface depression, thereby maintaining board flatness and improving heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If an elongated-shaped via conductor is formed in the mounting board to improve heat dissipation, then the heat dissipation ability is enhanced, but the filling amount of conducting member varies depending on position, causing irregular shape and degraded flatness of the wiring board

Engineering Contradiction:

Improveheat dissipation abilityVSAvoidflatness of the wiring board

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The patent introduces a resin filling part specifically inside the elongated via conductor to create local structural support. This resin filling compensates for the uneven conducting member distribution, maintaining uniform surface height across the via conductor while preserving the elongated shape's heat dissipation benefits.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The via conductor structure combines multiple materials: conducting member for electrical connectivity and heat dissipation, and resin filling material for structural support and surface flatness. This composite approach allows the via conductor to simultaneously achieve thermal performance and manufacturing precision requirements.

Inventive Principle:

Principle #40Composite materials

2Temperature

If an elongated-shaped via conductor is formed to increase heat dissipation, then the heat dissipation ability is improved, but stress imbalance occurs on the mounting board, affecting board stability

Engineering Contradiction:

Improveheat dissipation abilityVSAvoidstress balance of the mounting board

Core Design Contradiction:

TemperatureVSStability of the object's composition

Solution Approach 1:

The resin filling part acts as a counterbalancing element inside the elongated via conductor. It provides internal structural support that compensates for the stress concentration caused by the elongated shape, distributing mechanical stress more evenly across the mounting board and preventing warping or deformation.

Inventive Principle:

Principle #8Anti-weight (Counterweight)

3Adaptability or versatility

If circuit elements are densely mounted to achieve multi-banding functionality, then the device functionality is enhanced, but heat dissipation becomes more difficult due to limited space

Engineering Contradiction:

Improvemulti-banding functionalityVSAvoidheat dissipation

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent utilizes the vertical dimension (depth) of the via conductor by extending it in an elongated shape and filling it with resin and conducting members. This three-dimensional approach maximizes the heat dissipation surface area within the limited planar space, allowing efficient thermal management despite dense circuit element mounting.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures the flatness of the mounting board while effectively enhancing the heat dissipation ability of the high frequency module by maintaining a uniform filling density and reducing stress imbalance, thus stabilizing the board and improving thermal management.

Implementation Method 1

the via conductor having an elongated shape in a plan view of the mounting board... effectively enhancing the heat dissipation ability of the high frequency module by maintaining a uniform filling density and reducing stress imbalance

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10971466B2High frequency module and communication device

Publication Date: 2021.04.06 MURATA MFG CO LTD

AI summary

A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.