High-Frequency Package Dielectric Cavity Resonance Control
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Solution Overview
Problem
Conventional high-frequency packages experience terminal isolation failure and oscillation when the size of the high-frequency element approaches half the wavelength of the fundamental frequency, leading to cavity resonance issues.
Innovation Solution
Incorporating a dielectric space or cavity space surrounded by conductors between the high-frequency element and the substrates, which increases the effective dielectric constant and shifts the cavity resonance frequency, thereby enhancing terminal isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the high-frequency element size is increased to improve performance, then the isolation between terminals deteriorates due to cavity resonance
Solution Approach 1:
A dielectric member is introduced as an intermediary component between the high-frequency element and the ground conductor. This dielectric member has a specific dielectric constant (3.0 ≤ εr ≤ 120) and occupies a controlled volume (0.01 mm³ ≤ volume ≤ 100 mm³) to adjust the cavity resonance frequency without requiring changes to the high-frequency element itself or the overall package structure.
Solution Approach 2:
The invention changes the dielectric parameters of the package by introducing a dielectric member with specific dielectric constant and volume properties. This parameter change directly affects the cavity resonance frequency, allowing it to be shifted away from the operating frequency range to improve terminal isolation while maintaining element size.
2Productivity
If the high-frequency element size is close to half wavelength, then oscillation occurs due to cavity resonance
Solution Approach 1:
The dielectric member serves as a mediator that stabilizes the electromagnetic field distribution within the package. By positioning the dielectric member between the high-frequency element and ground conductor, it modifies the field patterns to prevent oscillation while allowing the element to operate at optimal sizes for productivity.
3Reliability
If conventional shielding structure is used, then terminal isolation is maintained, but cavity resonance frequency cannot be adjusted
Solution Approach 1:
The invention provides adaptability by allowing adjustment of the cavity resonance frequency through selection of dielectric members with different dielectric constants and volumes. The shielding structure is enhanced with this adjustable parameter, enabling resonance frequency tuning while maintaining terminal isolation performance across different operating conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The introduction of a dielectric or cavity space effectively improves terminal isolation by altering the resonance frequency, preventing oscillation and maintaining isolation between terminals.
Implementation Method 1
a cavity resonance frequency is generated near the fundamental frequency
Implementation Method 2
the effective dielectric constant in the shielded space increases by the value of the dielectric constant of the dielectric space
Data Source
Figure 1~2
Figure 3-1~3-2
AI summary
A high-frequency package 100 in the embodiment includes a first dielectric substrate 10 having a signal line and a grounding conductor 30 provided on a back side, a high-frequency element 20 connected to a back side of the first dielectric substrate with a first connection conductor 40 therebetween, a second dielectric substrate 11 having a signal line and a grounding conductor 30 provided on a front side facing the back side with the high-frequency element therebetween, and second connection conductors 41 that are arranged so as to surround the high-frequency element and connect the grounding conductor on the back side of the first dielectric substrate and the grounding conductor on the front side of the second dielectric substrate. In the high-frequency package 100 in the embodiment, a dielectric space 60 surrounded by a conductor pattern is formed in the front side of the second dielectric substrate under the high-frequency element.