High-Frequency PCB Transmission Layout Without Coaxial Cables

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Solution Overview

Problem

Existing high-frequency transmission systems in portable electronic devices face challenges with noise transmission and material costs due to the use of coaxial cables, which also incur higher assembly costs and defect rates in narrow internal spaces.

Innovation Solution

The implementation of a flexible printed circuit board (FPCB) with integrated rigid PCBs to replace coaxial cables, allowing for noiseless high-frequency signal transmission without affecting other modules, reducing material costs, and optimizing space usage in portable devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If coaxial cables are used for high-frequency transmission, then signal transmission quality is improved, but material cost and assembly cost increase

Engineering Contradiction:
Improvesignal transmission qualityVSAvoidmaterial cost and assembly cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces expensive coaxial cables with inexpensive PCB-trace-based transmission lines. The transmission function is integrated directly into the PCB structure using standard copper traces and vias, eliminating the need for separate coaxial cable components and their associated connectors, thereby significantly reducing material and assembly costs while maintaining high-frequency signal transmission capability.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent merges the transmission line function with the PCB structure itself. The signal transmission path is formed by copper traces and vias that are part of the PCB manufacturing process, combining the circuit board and transmission line into a single integrated structure, thus eliminating separate coaxial cable assemblies and reducing overall system complexity.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If coaxial cables with small connectors are used, then high-frequency signal transmission is achieved, but defect rate increases due to narrow internal spaces

Engineering Contradiction:
Improvehigh-frequency signal transmissionVSAvoiddefect rate in assembly
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent integrates the transmission line directly into the PCB structure using copper traces and vias that are formed during standard PCB manufacturing processes. This eliminates the need for separate coaxial cable assemblies and their small connectors, thereby avoiding assembly defects in narrow internal spaces while maintaining high-frequency signal transmission capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces the mechanical coaxial cable connector system with an electrical trace-based transmission line on the PCB. The connection is achieved through soldered pads and vias rather than mechanical plug-and-play connectors, eliminating assembly complexity and defect risks associated with small connectors in confined spaces.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If FPCB is used to replace coaxial cable, then material cost is reduced, but line loss increases

Engineering Contradiction:
Improvematerial costVSAvoidline loss
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent applies different PCB structure types in different sections of the transmission path. Rigid PCB sections with controlled impedance and optimized trace geometry are used in areas requiring low line loss, while flexible PCB sections are used where bending and flexibility are needed. This localized optimization maintains low line loss while preserving the cost benefits of FPCB technology.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent creates a composite PCB structure combining rigid and flexible PCB sections. The rigid portions provide stable electrical characteristics and low loss for high-frequency signals, while the flexible portions provide mechanical adaptability. This composite structure mitigates the line loss issue of pure FPCB while maintaining cost advantages over coaxial cables.

Inventive Principle:
Principle #40Composite materials

4Loss of energy

If rigid PCB is disposed between FPCB transmission lines, then line loss is reduced, but device complexity increases

Engineering Contradiction:
Improveline lossVSAvoidPCB structure complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The patent merges the rigid and flexible PCB sections into a single integrated PCB assembly. The rigid portion serves as both the structural support and the low-loss transmission medium, while the flexible portion provides connectivity and adaptability. This integration reduces the number of separate components and assembly steps, thereby reducing device complexity despite the multi-section structure.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11749880B2Electronic device including high-frequency transmission circuit
Publication Date: 2023.09.05 SAMSUNG ELECTRONICS CO LTD
  • US11749880B2 patent drawing
  • US11749880B2 patent drawing
  • US11749880B2 patent drawing

AI summary

Disclosed is a portable communication device including a housing, a first printed circuit board (PCB) disposed in the housing, a wireless communication circuit mounted on the first PCB, and a second PCB including a connection part connected with the first PCB, a first PCB portion extended from the connection part and having greater flexibility than the connection part, a second PCB portion extended from the first PCB portion and having less flexibility than the first PCB portion, a third PCB portion extended from the second PCB portion and having greater flexibility than the second PCB portion, a fourth PCB portion extended from the third PCB portion and having less flexibility than the first PCB portion, a signal line extended to the connection part along the first, second, third, and fourth PCB portions, and vias arranged in at least a partial area of the second PCB portion or the fourth PCB portion, wherein a portion of the signal line is located between some of the vias.