High-Frequency Line Pin Layout for Wideband Crosstalk Reduction
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Solution Overview
Problem
Current high-frequency line structures on printed boards face challenges in impedance matching and crosstalk reduction, making it difficult to achieve stable propagation of high-frequency signals from DC to 70 GHz due to the miniaturization of optoelectronic components.
Innovation Solution
A high-frequency line structure is designed with ground lead pins and signal lead pins arranged in a specific configuration, where signal lead pins spring up from a horizontal plane to reduce crosstalk, and a manufacturing method involving thick and thin lead frames with ridge portions is used to ensure accurate positioning and electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the pitch of high-frequency lines is reduced to accommodate miniaturized optoelectronic components, then component density is improved, but crosstalk between adjacent lines increases
Solution Approach 1:
The invention segments the lead pin structure into distinct ground lead pins and signal lead pins with different configurations. Ground lead pins extend vertically to provide reference potential, while signal lead pins have spring-up portions that elevate signal lines above the ground plane, physically separating signal paths from ground returns to reduce electromagnetic coupling and crosstalk between adjacent lines.
Solution Approach 2:
The invention transitions from a two-dimensional planar arrangement to a three-dimensional structure by introducing spring-up portions that extend signal lead pins vertically above the ground plane. This dimensional change creates spatial separation between signal lines and ground lines, reducing parasitic capacitance and crosstalk while maintaining compact horizontal pitch for high component density.
2Ease of manufacture
If conventional lead pin structures are used without impedance matching configuration, then manufacturing simplicity is maintained, but high-frequency signal propagation stability deteriorates
Solution Approach 1:
The invention applies different structural qualities to different lead pin types: ground lead pins have uniform vertical extension for stable reference potential, while signal lead pins incorporate spring-up portions with specific geometries to control impedance characteristics. This local differentiation of structural quality enables impedance matching for high-frequency signals while maintaining overall manufacturing simplicity through standardized lead frame processes.
Data Source
Figure 1A
Figure 1B
Figure 2A
AI summary
A high-frequency line structure (10) of the present invention includes: a high-frequency line substrate (111); ground lead pins (122) fixed to ground ends provided in a bottom surface of the high-frequency line substrate; and signal lead pins (132) fixed to signal line ends provided in the bottom surface of the high-frequency line substrate, wherein the signal lead pins (132) are arranged between the ground lead pins (122), the signal lead pins (132) have a structure in which each of the signal lead pins (132) springs up in a direction toward a side on which the high-frequency line substrate is arranged, from a horizontal plane to which bottom surfaces of the ground lead pins (122) pertains, and spring-up heights in the structure in which the respective signal lead pins (132) spring up are substantially the same. With this configuration, the high-frequency line structure (10) of the present invention can reduce crosstalk in a wide band and provide excellent high-frequency characteristics.