High Frequency Power Supply Member With Internal Refrigerant Flow Path
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Solution Overview
Problem
High frequency power supply systems face significant thermal loads during high-frequency power transmission, leading to increased temperatures and potential electrical contact issues in plasma processing apparatuses.
Innovation Solution
Incorporating refrigerant flow paths within the inner and outer conductors of the high frequency power supply member, which are designed to reduce thermal loads by maximizing cooling efficiency through structures like helical paths and protrusions, and manufactured using advanced techniques such as 3D printing to enhance design flexibility and cooling performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high frequency power is transmitted through conductors, then power transmission is achieved, but thermal load increases causing temperature rise
Solution Approach 1:
A refrigerant flow path is introduced as an intermediary cooling medium between the inner and outer conductors. The refrigerant absorbs heat from the conductor during high frequency power transmission, preventing temperature rise while allowing full power transmission capability
Solution Approach 2:
The invention utilizes fluid dynamics by circulating refrigerant through the flow path formed between conductors. The moving refrigerant carries away thermal energy, converting the thermal management problem into a fluid transport solution that cools the conductor during operation
2Loss of energy
If conductor size is increased to reduce resistance, then power transmission efficiency improves, but device complexity and space requirements increase
Solution Approach 1:
The inner conductor is nested within the outer conductor, forming a coaxial structure with a refrigerant flow path between them. This nested arrangement achieves effective cooling and electrical transmission without requiring excessively large individual conductor dimensions, maintaining compact device geometry
Solution Approach 2:
The invention adds a thermal management dimension by introducing the refrigerant flow path in the radial direction between conductors. This dimensional addition allows heat removal without increasing the longitudinal length or cross-sectional area of the power transmission path
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses temperature rises in the high frequency power supply member, reducing contact resistance and preventing burnout, while maintaining the integrity of insulating components and ensuring reliable electrical connections.
Implementation Method 1
a refrigerant flow path is provided inside a wall surface of at least one of the inner conductor and the outer conductor
Implementation Method 2
reduce a thermal load in a transmission path of high frequency power
Data Source
AI summary
A high frequency power supply member for supplying high frequency power includes: an inner conductor that forms a hollow; and an outer conductor arranged to surround the inner conductor, wherein a refrigerant flow path is provided inside a wall surface of at least one of the inner conductor and the outer conductor.