High Frequency Probe Device for Multi-Pad Characterization

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Solution Overview

Problem

Existing high frequency characteristic measuring devices are unable to efficiently measure devices with multiple pads before they are mounted in a package, resulting in high costs and time consumption.

Innovation Solution

A high frequency characteristic measuring device with multiple probe needles and matching circuits allows for direct contact and measurement of devices with multiple pads before packaging, utilizing input and output matching circuit substrates with coaxial connectors to facilitate quick and cost-effective characterization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a coplanar type measuring device with only one probe needle is used, then the device complexity is low, but it cannot measure devices with multiple pads, resulting in loss of functionality

Engineering Contradiction:

Improvemeasurement capability for multi-pad devicesVSAvoidnumber of probe needles

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The measuring device is segmented into multiple independent probe needles (first probe needle, second probe needle, etc.) each capable of contacting different pads. This segmentation allows the device to measure multiple parameters simultaneously, enabling measurement of devices with multiple pads while maintaining manageable complexity through modular design

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The measuring device is designed with multiple probe needles that can contact different pads (input pad, output pad, ground pad) of the device under test. This multi-functional capability allows a single measuring device to handle various device configurations and pad arrangements, significantly improving adaptability without requiring separate measuring systems for each device type

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Productivity

If devices are measured after mounting in a package, then measurement functionality is achieved, but considerable cost and time are required

Engineering Contradiction:

Improvemeasurement speedVSAvoidtime for packaging and measurement

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The measuring device enables high frequency characteristic measurements to be performed on devices before they are mounted in packages. By conducting measurements in advance on the device under test with its pads directly accessible, the need for packaging followed by measurement is eliminated, significantly reducing both time and cost while improving productivity

Inventive Principle:

Principle #10Preliminary action

3Reliability

If devices are measured after mounting in a package, then measurement can be performed, but measurement cost increases significantly

Engineering Contradiction:

Improvemeasurement feasibilityVSAvoidmeasurement cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS8659304B2High frequency characteristic measuring device

Publication Date: 2014.02.25 MITSUBISHI ELECTRIC CORP

AI summary

A high frequency characteristic measuring device for measuring high frequency characteristics of a high frequency device to be measured by contacting probe needles with the high frequency device to be measured, before mounting of the high frequency device to be measured. The high frequency characteristic measuring device includes an input matching circuit substrate with an input matching circuit thereon, a first coaxial connector electrically connected to the input matching circuit substrate, and first probe needles electrically connected to the input matching circuit substrate. The high frequency characteristic measuring device further includes an output matching circuit substrate with an output matching circuit thereon, a second coaxial connector electrically connected to the output matching circuit substrate, and second probe needles electrically connected to the output matching circuit substrate.