High Frequency Module Shield Recess for Heat and Resonance
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Solution Overview
Problem
High frequency modules face challenges in heat dissipation performance due to limited heat dissipation paths and a decrease in cavity resonant frequency or waveguide cutoff frequency caused by thermally conductive materials with high relative permittivity.
Innovation Solution
An electromagnetic shield structure featuring a dielectric substrate with a grounding conductor, a metal housing with recesses forming distinct spaces for the high frequency circuit, and a thermally conductive material for heat dissipation, which increases the cavity resonant frequency and waveguide cutoff frequency while enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermally conductive sheet is arranged between the high frequency package and the metal casing to enhance heat dissipation, then heat dissipation performance is improved, but the cavity resonant frequency or waveguide cutoff frequency is decreased
Solution Approach 1:
The recess in the metal housing is divided into two distinct spaces: a first space with a first bottom face and first side face, and a second space with a second bottom face and second side face. The second space protrudes from the first space toward the outer peripheral side. This segmentation allows different regions to serve different functions: the first space provides thermal conduction path while the second space maintains electromagnetic isolation and resonant frequency characteristics.
Solution Approach 2:
Different regions of the recess are assigned different functional qualities. The first space is optimized for heat dissipation with its bottom face and side face configuration, while the second space is optimized for maintaining cavity resonant frequency by protruding toward the outer peripheral side. This local differentiation resolves the contradiction between heat dissipation and frequency maintenance.
2Volume of moving object
If the size of the high frequency module is reduced, then integration is improved, but the isolation of high frequency circuits is degraded
Solution Approach 1:
The recess structure utilizes three-dimensional spatial configuration with the second space protruding from the first space toward the outer peripheral side. This dimensional arrangement creates effective electromagnetic isolation zones without increasing the overall module footprint, allowing compact design while maintaining circuit isolation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively increases the cavity resonant frequency and waveguide cutoff frequency while improving heat dissipation performance, balancing these parameters for high frequency circuits in modules like wireless communication devices.
Implementation Method 1
a thermally conductive material being electrically insulative... The thermally conductive material is sandwiched between the first bottom face or second bottom face and the high frequency circuit
Implementation Method 2
The metal housing includes a heat dissipation structure
Data Source
AI summary
A recess in a metal housing accommodating a high frequency package includes a first space and a second space and has a winners podium shape in cross-sectional view. A thermally conductive material is sandwiched between the metal housing having heat dissipating fins and the high frequency package.