High Frequency Switch Module DC Conductor Overlap
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Solution Overview
Problem
Conventional high frequency switch modules experience mutual interference between communication signals and drive power/control signals due to close arrangement of conductors, leading to issues like direct current voltage superimpositions on communication signals and high frequency noise on drive power/control signals.
Innovation Solution
The high frequency switch module design incorporates a multilayer substrate with direct current voltage conductors arranged to overlap partially in planes perpendicular to the stacking direction, separating them from high frequency transmission conductors and reducing wiring areas, thereby increasing the separation distance between drive power/control signals and communication signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the multilayer substrate is reduced in size, then the compactness is improved, but the conductors for switch control and conductors transmitting communication signals are arranged close to each other causing mutual interference
Solution Approach 1:
The patent applies dimensionality change by routing DC voltage conductors vertically through the multilayer substrate using via holes, allowing them to overlap in the stacking direction while maintaining horizontal separation from high frequency transmission conductors. This transforms a 2D layout problem into a 3D solution, enabling compact substrate design without conductor interference
Solution Approach 2:
The patent segments the conductor routing into distinct functional groups: DC voltage conductors are concentrated in specific vertical regions and routed through via holes, while high frequency transmission conductors are confined to horizontal routing in specific layers. This segmentation prevents interference by spatially separating different signal types
2Area of stationary object
If the conductors for switch control and conductors transmitting communication signals are arranged close to each other, then the wiring area is reduced, but mutual interference occurs between signals
Solution Approach 1:
The patent utilizes the vertical dimension by routing DC voltage conductors through via holes across multiple layers, allowing them to overlap in the stacking direction. This enables the wiring area to be minimized while maintaining adequate separation between DC voltage conductors and high frequency transmission conductors in the horizontal plane, preventing signal interference
Solution Approach 2:
The patent introduces via holes as intermediary structures that connect different layers of the multilayer substrate. These via holes serve as mediators that allow DC voltage conductors to transition between layers vertically, enabling compact routing while maintaining separation from high frequency signals that remain confined to specific horizontal layers
Data Source
AI summary
A high frequency switch module includes a multilayer substrate and a switch IC. The switch IC is mounted on a top plane of the multilayer substrate. A drive power signal input port and control signal input ports are connected to direct current external input ports through direct current voltage conductors, respectively. In-layer conductors of the direct current voltage conductors are arranged so that the in-layer conductors overlap each other at least partially in a state in which the multilayer substrate is viewed along a stacking direction.