High Frequency Switch Orthogonal Strip Conductors
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Solution Overview
Problem
Current high-frequency signal switches are unable to handle frequencies above 85 GHz effectively due to increased complexity and cost, and require a larger physical footprint.
Innovation Solution
A high-frequency switch design featuring orthogonally arranged strip conductors and a switching actuator that moves between positions to achieve high isolation and signal switching, with a compact footprint and low construction cost, utilizing a sandwich construction and non-conductive support elements for precise positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional high frequency switches are used to handle signals above 85 GHz, then frequency handling capability is improved, but device complexity and construction cost increase
Solution Approach 1:
The switch is divided into multiple independent switching units, each handling a specific signal path. Each unit consists of simple planar conductors and switching elements that can be independently manufactured and assembled, reducing overall system complexity while maintaining high frequency capability
Solution Approach 2:
The patent transitions from three-dimensional complex waveguide structures to two-dimensional planar conductor arrangements. The signal paths are laid out in flat layers with orthogonal orientations, simplifying the structural complexity while preserving electromagnetic signal integrity at high frequencies
2Reliability
If conventional high frequency switches are used to handle signals above 85 GHz, then frequency handling capability is improved, but construction cost increases
Solution Approach 1:
The switch is divided into multiple independent switching units, each handling a specific signal path. Each unit consists of simple planar conductors and switching elements that can be independently manufactured and assembled, reducing overall system complexity while maintaining high frequency capability
Solution Approach 2:
The patent changes the geometric parameters of the conductors, specifically using orthogonal planar arrangements with controlled dimensions and spacing. This simplifies manufacturing by allowing standard fabrication processes while maintaining the electromagnetic performance required for high frequency operation
3Reliability
If conventional high frequency switches are used, then frequency handling capability is improved, but physical footprint increases
Solution Approach 1:
The patent transitions from three-dimensional complex waveguide structures to two-dimensional planar conductor arrangements. The signal paths are laid out in flat layers with orthogonal orientations, simplifying the structural complexity while preserving electromagnetic signal integrity at high frequencies
Solution Approach 2:
Multiple signal paths and switching elements are arranged in a compact nested configuration where conductors are positioned in orthogonal planes and layers. This allows multiple signal channels to share the same physical space efficiently, reducing the overall footprint while maintaining signal isolation and integrity
Data Source
AI summary
A high frequency switch is provided. The high frequency switch comprises a first high frequency connector, comprising a first inner conductor, integrally formed with a first strip conductor. Moreover, the high frequency switch comprises a second strip conductor arranged orthogonally in a first plane relative to the first strip conductor, a third strip conductor, arranged orthogonally in the first plane relative to the first strip conductor, a first switching conductor, having an orthogonally angled shape relative to the first plane, a second switching conductor, having an orthogonally angled shape relative to the first plane. A switching actuator is mechanically connected to the first switching conductor and to the second switching conductor adapted to move vertically relative to the first plane, to a first position and to a second position.


