High Frequency Wiring Board Ground Pattern Segmentation
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Solution Overview
Problem
High-frequency wiring boards with interconnected lines on different layers face signal reflection issues due to impedance mismatching, which worsens as frequencies increase, despite existing methods to improve reflection characteristics.
Innovation Solution
The design separates the first and second ground patterns in the high-frequency wiring board, limiting the high-frequency current paths to a single path through conductive vias, reducing phase interference and improving reflection characteristics across a broad frequency range by optimizing the spacing and separation of conductive vias and ground patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple ground patterns are used to connect different high-frequency transmission lines on different layers, then electrical connection is achieved, but signal reflection increases due to impedance mismatching and phase interference
Solution Approach 1:
The ground pattern is segmented into a first ground pattern on the first wiring layer and a second ground pattern on the second wiring layer, with their connection points separated. This segmentation prevents the formation of multiple parallel current paths that cause phase interference, thereby reducing signal reflection while maintaining electrical connectivity between layers.
2Reliability
If ground patterns are connected through multiple conductive vias, then electrical conductivity between layers is improved, but phase difference increases causing worse reflection characteristics at high frequencies
Solution Approach 1:
The invention applies different configurations to different parts of the ground pattern system: the first ground pattern and second ground pattern are selectively positioned and connected through conductive vias at specific locations. This local optimization ensures proper electrical connectivity where needed while avoiding configurations that would create harmful phase differences and signal reflection.
3Ease of manufacture
If conventional ground pattern connections are used, then manufacturing is simplified, but reflection characteristics deteriorate as frequency increases
Solution Approach 1:
The invention extends the ground pattern connection problem into the third dimension by utilizing multiple wiring layers. The first ground pattern on the first wiring layer and the second ground pattern on the second wiring layer are connected through conductive vias, creating a spatially distributed connection structure that reduces phase interference and improves reflection characteristics across a broad frequency range while remaining manufacturable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively improves reflection characteristics from low to high frequencies, maintaining superior performance even at higher frequencies by restricting high-frequency current paths and minimizing phase differences.
Implementation Method 1
connections are realized by vias or through-holes having conductivity
Data Source
AI summary
The high-frequency wiring board of the present invention includes: first coplanar lines provided with a first signal line and a first planar ground pattern formed on the same wiring layer as the first signal line; second coplanar lines provided with a second signal line formed on a different wiring layer than the first signal line and a second planar ground pattern formed on the same wiring layer as the second signal line; and a first ground pattern formed on the same wiring layer as the first coplanar lines. The first coplanar lines and the second coplanar lines are connected. At least the first ground pattern and the first planar ground pattern are separated in a region following the second signal line from the connection of the first signal line and the second signal line.