Waveguide Launcher Package with High-K Carrier for Low-Loss Interfaces
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor manufacturing processes struggle to create precise circuit waveguide interfaces for high-frequency applications, such as millimeter wave systems, leading to increased cost and complexity.
Innovation Solution
A method and apparatus for fabricating circuit waveguide interfaces during wafer-scale die packaging using a high-k glass or ceramic carrier with an air cavity structure, integrating a differential pair to waveguide launcher, and forming conductive via walls or rings to reduce insertion loss and relax alignment tolerance requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional semiconductor manufacturing processes are used to create waveguide interfaces, then manufacturing simplicity is maintained, but manufacturing precision is insufficient for high-frequency applications
Solution Approach 1:
The waveguide interface structure is segmented into distinct functional regions: a first region with a first dielectric constant for the semiconductor die, a second region with a second dielectric constant for the waveguide, and a third region with a third dielectric constant for the transition. This segmentation allows each region to be optimized for its specific function while being manufactured using standard semiconductor processes, thereby achieving high precision without excessive complexity.
Solution Approach 2:
Different dielectric regions are assigned different dielectric constants tailored to their local functional requirements. The first dielectric region supports the semiconductor die with appropriate electrical properties, the second dielectric region provides the waveguide structure with optimized electromagnetic characteristics, and the third dielectric region facilitates the transition between them. This local optimization of material properties enables precise control of electromagnetic fields at each location.
2Adaptability or versatility
If waveguide interfaces are added to packaged integrated circuit devices, then high-frequency communication capability is improved, but device complexity increases
Solution Approach 1:
The waveguide interface structure merges multiple functions into a single integrated component within the package substrate. The transition structure combines dielectric regions, conductor patterns, and waveguide geometry into one unified element that simultaneously provides electrical connection, electromagnetic field confinement, and impedance transformation. This merging approach enables high-frequency communication capability while avoiding the need for separate discrete components that would increase overall device complexity.
Solution Approach 2:
The waveguide interface structure serves multiple functions: it provides the waveguide cavity for electromagnetic wave propagation, creates the transition structure for mode conversion between microstrip and waveguide modes, provides electrical connection through conductor patterns, and offers mechanical support within the package. This multi-functionality reduces the need for additional separate components and simplifies the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of high-performance circuit waveguide interfaces with reduced insertion loss and lower cost and complexity, facilitating high-frequency communication in semiconductor devices.
Implementation Method 1
a high-k dielectric carrier substrate... having a dielectric constant k of at least approximately k=5.8
Data Source
AI summary
A wafer-scale die packaging device is fabricated by providing a high-k glass carrier substrate having a ceramic region which includes a defined waveguide area and extends to a defined die attach area, and then forming, on a first glass carrier substrate surface, a differential waveguide launcher having a pair of signal lines connected to a radiating element that is positioned adjacent to an air cavity and surrounded by a patterned array of conductors disposed over the ceramic region in a waveguide conductor ring. After attaching a die to the glass carrier substrate to make electrical connection to the differential waveguide launcher, a molding compound is formed to cover the die, differential waveguide launcher, and air cavity, and an array of conductors is formed in the molding compound to define a first waveguide interface perimeter surrounding a first waveguide interface interior.