High Modulus Spunbond Nonwoven for Deep Draw Molding

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Solution Overview

Problem

Existing spunbond nonwoven materials lack the high modulus and elongation capabilities required for deep draw molding applications, particularly in high-temperature conditions, due to insufficient bonding strength and thermal stability.

Innovation Solution

A method for producing a high modulus spunbond nonwoven material using a combination of thermoplastic polyester matrix fibers and aromatic copolyester binder fibers, where the binder fibers are thermally activated to create a strong bond with the matrix fibers, with a specific ratio of spinneret holes and fiber diameters optimized for high tensile strength and elongation, and thermally bonded using calendar rolls and hot air to achieve elevated temperature stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional spunbond nonwoven materials are used, then the material can be easily manufactured, but the modulus and elongation capabilities are insufficient for deep draw molding applications

Engineering Contradiction:
Improvemodulus and elongation capabilitiesVSAvoidmanufacturing complexity
Core Design Contradiction:
StrengthVSEase of manufacture

Solution Approach 1:

The patent uses a composite fiber structure consisting of polyester matrix fibers (8.0-13.0 dtex) and aromatic copolyester binder fibers (3.0-6.0 dtex) in a specific weight ratio (90-95% matrix, 5-10% binder). This composite structure provides both the required mechanical properties (modulus and elongation) for deep draw molding and maintains ease of manufacture through a standardized spinning and bonding process.

Inventive Principle:
Principle #40Composite materials

2Reliability

If insufficient bonding strength is present, then the material can be produced with simpler processes, but the thermal stability and bonding strength are inadequate for high-temperature applications

Engineering Contradiction:
Improvethermal stability and bonding strengthVSAvoidbonding process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent achieves reliable thermal bonding by controlling specific parameters: the binder fiber melting point is selected to be lower than the matrix fiber melting point, allowing selective bonding at temperatures that provide adequate thermal stability. The bonding process parameters (temperature, pressure, time) are optimized to create strong bonds without requiring excessively complex equipment or multi-step processes.

Inventive Principle:
Principle #35Parameter changes

3Strength

If the spinneret hole ratio is not optimized, then the manufacturing process is simpler, but the tensile strength and elongation properties are insufficient

Engineering Contradiction:
Improvetensile strength and elongationVSAvoidspinneret hole ratio control
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent specifies an optimized spinneret hole ratio where the number of matrix fiber holes (#SHMATRIX) to binder fiber holes (#SHBINDER) is controlled within a specific range. This parameter optimization ensures proper fiber distribution and bonding, achieving the required tensile strength and elongation properties while maintaining manufacturability through a single-spinneret process.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resulting material exhibits enhanced mechanical properties, including hot tensile strength and elongation, making it suitable for high draw molding applications, such as automotive flooring products, with improved thermal bonding and resistance to deformation under elevated temperatures.

Implementation Method 1

the binder fibers are thermally activated to create a strong bond with the matrix fibers

Methodology Applied
Scientific EffectThermal bonding: Melting

Implementation Method 2

heated to melt the binder fibers and form said non-woven web

Methodology Applied
Scientific EffectThermal activation: Heating

Data Source

PatentUS10682795B2High modulus spunbond
Publication Date: 2020.06.16 FREUDENBERG PERFORMANCE MATERIALS LP

AI summary

The present invention is directed at a relatively high modulus spunbond nonwoven material that is suitable for use in relatively high deep draw molding applications.