High pH Cleaning Composition for Organic Film Post-CMP
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Solution Overview
Problem
Current cleaning methods for organic films after chemical mechanical polishing (CMP) are inefficient, as pollutants tend to re-adsorb onto brushes, leading to decreased cleaning efficiency and shortened brush lifespan, and can cause scratches on the film surface, particularly due to the soft nature of organic films.
Innovation Solution
A cleaning composition comprising an organic solvent, organic acid, chelating agent, and surfactant with at least one hydroxyl group, maintained at a pH of 12 or higher, which minimizes pollutant re-adsorption and reduces scratch generation by creating a repulsion force between the film and pollutants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a brush made of polyvinyl alcohol is used to clean the organic film surface, then cleaning action is provided, but pollutants are re-adsorbed onto the brush and transferred back to the wafer, decreasing cleaning efficiency and shortening brush lifespan
Solution Approach 1:
A cleaning composition is introduced as an intermediary substance between the brush and the organic film surface. This composition contains surfactants and chelating agents that prevent pollutant re-adsorption onto the brush by forming stable complexes with pollutants in the liquid phase, thereby eliminating the transfer cycle while maintaining mechanical cleaning action
Solution Approach 2:
The chemical composition of the cleaning solution is specifically designed with pH control and surfactant selection to alter the adsorption parameters at the brush-pollutant interface. By adjusting chemical parameters (pH, surfactant concentration, chelating agent type), the solution prevents electrostatic and van der Waals attraction between pollutants and brush fibers
2Productivity
If the brush is narrowed to increase cleaning efficiency, then cleaning effectiveness improves, but the brush and wafer frequently contact, causing pollutant collection at edges and center and abrupt efficiency decrease
Solution Approach 1:
The cleaning composition acts as a mediator that prevents direct harmful contact between pollutants and brush surfaces. By forming soluble complexes with pollutants through chelating agents and surfactants, the composition eliminates the stick-slip phenomenon and prevents pollutant accumulation at edges and center, ensuring stable cleaning performance throughout brush operation
3Ease of operation
If cleaning is performed by spraying cleaning composition and rotating brush, then cleaning action is achieved, but scratches are generated on the soft organic film surface
Solution Approach 1:
The cleaning composition serves as a protective intermediary layer between the brush and the soft organic film. This liquid medium reduces direct mechanical contact forces by providing lubrication and distributing brush pressure, thereby preventing scratches while maintaining effective pollutant removal through chemical complexation and surfactant action
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cleaning composition effectively removes pollutants from organic films, preventing re-adsorption onto brushes and reducing surface scratches, thereby enhancing cleaning efficiency and extending brush lifespan.
Implementation Method 1
a chelating agent
Implementation Method 2
a surfactant containing at least one hydroxyl group (OH) at the end
Implementation Method 3
creating a repulsion force between the film and pollutants
Data Source
AI summary
A cleaning composition includes an organic solvent, an organic acid, a chelating agent, a surfactant containing at least one hydroxyl group (OH) at the end, and an ultra pure water, wherein a pH value of the cleaning composition is equal to or higher than 12.