High-Power Semiconductor Test Socket for Current and Thermal Management
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Solution Overview
Problem
There is a need for accurate and reliable testing of high-power semiconductor components, particularly in power inverters and rectifiers, to meet the growing demand for testing these components effectively.
Innovation Solution
A test socket comprising a holder block and contact elements with conductive surfaces, where the holder block supports and transmits test signals, and includes features like elastic portions, fins for slot arrangement, and fluid channels for heat dissipation, allowing for increased current load and efficient testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional test sockets are used for high-power semiconductor components, then the testing can be performed, but the current load capacity is insufficient and thermal dissipation is inadequate
Solution Approach 1:
The holder block is divided into multiple support sections, each supporting contact elements with conductive surface portions. This segmentation allows distributed current carrying and thermal dissipation across multiple contact points, increasing overall current load capacity while maintaining reliability through redundant contact paths.
Solution Approach 2:
The holder block integrates multiple functions: mechanical support for contact elements, electrical conduction through conductive support sections, and thermal dissipation via fluid channels. This merging of functions into a single component enables simultaneous handling of high current loads and thermal management, resolving the contradiction between power capacity and reliability.
2Power
If the holder block transmits test signals, then current load capacity increases, but thermal management becomes more challenging
Solution Approach 1:
Fluid channels are introduced as an intermediary thermal management system within the holder block. These channels carry coolant that absorbs heat from the conductive support sections and contact elements, enabling the holder block to transmit high current loads while maintaining acceptable temperature levels through active thermal intervention.
3Measurement precision
If contact elements are firmly held for reliable contact, then measurement precision improves, but mechanical stress on contact elements increases
Solution Approach 1:
The contact elements have non-uniform structure with elastic portions that provide localized compliance. The elastic portions can deform to accommodate minor misalignments and maintain reliable electrical contact, while the conductive surface portions remain firmly held for precise measurement. This local differentiation of mechanical properties resolves the contradiction between contact reliability and stress reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable and efficient testing of high-power semiconductor components by maximizing current load, balancing electrical and thermal loads, and providing effective thermal dissipation, thus meeting the demands of advanced testing requirements.
Implementation Method 1
the holder block comprises a plurality of electrically conductive support sections, for supporting the conductive surface portions of the plurality of contact elements, wherein the plurality of support sections makes electrical contact to the plurality of conductive surface portions by supporting the conductive surface portions, and wherein the holder block at least partially transmits a test signal
Implementation Method 2
The holder block may be made (completely and monolithically) of a solid material which is electrically conductive, such as metal material. The conductive support sections of the holder block may form together a common surface of the holder block.
Data Source
AI summary
A test socket for and a method of testing electronic components, in particular high-power semiconductor components comprise: a plurality of contact elements, being adapted to contact to the electronic component; a holder block for holding and arranging the plurality of contact elements, wherein each contact element of the plurality of contact elements comprises at least one conductive surface portion; wherein the holder block comprises a plurality of electrically conductive support sections, for supporting the conductive surface portions of the plurality of contact elements, wherein the plurality of support sections, makes electrical contact to the plurality of conductive surface portions by supporting the conductive surface portions, and wherein the holder block at least partially transmits a test signal.