High Temperature High Pressure RFID Tag Design
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Solution Overview
Problem
RFID tags face challenges in durability and readability in high temperature and high pressure environments, such as downhole and subsea applications, where they must withstand extreme conditions and mechanical forces while maintaining functionality.
Innovation Solution
The RFID tag is designed with a glass bead containing an electronics module and an antenna, packaged in a silicone gel material and housed within a carrier made of high-performance thermoplastic, which provides protection against mechanical and chemical stresses, and is embedded into the surface of objects like pipes using a pre-formed tag pocket for secure installation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If RFID tags are designed for extreme environmental conditions, then durability improves, but device complexity increases due to additional protective structures
Solution Approach 1:
Multiple protective functions are merged into a single integrated carrier housing structure. The carrier combines mechanical protection, environmental sealing, and mounting features into one component, reducing the overall number of parts while maintaining durability in extreme conditions.
Solution Approach 2:
The carrier housing is designed with multi-functionality to serve as both a protective enclosure and a mounting mechanism. Features such as integrated threads or attachment points allow the same structure to provide both environmental protection and secure installation, eliminating the need for separate mounting hardware.
2Reliability
If RFID tags are protected against mechanical and chemical stresses, then durability improves, but ease of installation deteriorates due to complex packaging requirements
Solution Approach 1:
The RFID tag components are pre-assembled and pre-protected within the carrier housing before field installation. The electronics module is already encapsulated in the bead, and the antenna is pre-positioned, so that the entire assembly can be installed as a single unit without requiring complex on-site assembly procedures.
Solution Approach 2:
The RFID tag employs a nested structure where the electronics module is contained within the bead, which is in turn housed within the carrier. This nested arrangement protects components while maintaining a compact form factor that simplifies handling and installation compared to distributed component layouts.
Data Source
AI summary
An identification tag, comprising a rigid carrier comprising a cavity therein, a bead arranged within the cavity, wherein the bead includes an electronics module configured to receive and transmit signals, a protective fluid-like fill material disposed in the cavity such that it surrounds the bead, and one or more openings extending into the identification tag that can be used to couple the tag to a downhole tool or provide pressure equalization across the tag.