High-Profile Network Transceiver Connector for PCB Heat Dissipation
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Solution Overview
Problem
High-speed computer network connectors face challenges in space efficiency and heat dissipation due to their low-profile design, which limits the number of connections on a printed circuit board and increases power consumption and heat production as data transmission rates rise.
Innovation Solution
A high-profile connector design with a longer axis perpendicular to the circuit board, exposing more transceiver surface area for cooling and allowing for increased connection density, which enhances airflow and heat dissipation compared to traditional low-profile connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a low-profile connector design is used, then the connector fits within standard circuit board space constraints, but the number of connections per board is limited and heat dissipation is reduced
Solution Approach 1:
The connector transitions from a low-profile design to a high-profile design, utilizing the vertical dimension (height perpendicular to the circuit board) to increase the number of connections and improve heat dissipation. The connector body extends further from the circuit board surface, creating additional space for connection elements and improving airflow for thermal management.
2Speed
If data transmission rate is increased, then network performance is improved, but power consumption and heat production increase
Solution Approach 1:
The patent converts the harmful effect of increased heat production (resulting from higher data transmission rates) into a beneficial outcome by designing a high-profile connector structure that actively promotes heat dissipation. The extended profile creates natural airflow channels and increases surface area for thermal exchange, turning the heat problem into an opportunity for improved thermal management.
3Temperature
If connector profile is increased from low to high, then heat dissipation and connection density are improved, but connector height increases
Solution Approach 1:
The high-profile connector design applies local quality by concentrating the increased height specifically in regions where it provides functional benefit - namely, where connection elements are positioned to increase connection density and where the extended structure creates airflow channels for heat dissipation. The profile increase is not uniform throughout but strategically positioned to optimize thermal and electrical performance.
Data Source
AI summary
A device connects a computer network cable transceiver to a printed circuit board. The device includes a high-profile connector body that mounts to a printed circuit board. The height of the device above the printed circuit board is greater than the width of the device on the printed circuit board. The device has a receiving element that receives and electrically connects the network cable transceiver to an electrical connection element. The rotated aspect of this device controls the profile of the network cable transceiver that is inserted into the device. The electrical connection element is mechanically and electrically attached to the printed circuit board to enable data transfer to and from the network cable transceiver. Some embodiments of the invention have a variable-length electrical communication element that permits the electrical connection element to mount to the printed circuit board in a variety of positions and orientations rather than the fixed position and orientation of a low-profile network cable connector.