High-Purity Epoxy Compound for Low-Shrinkage Transparent Curing
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Solution Overview
Problem
There is a demand for curable compounds that are less susceptible to curing shrinkage, with existing products exhibiting low purity, poor heat resistance, and transparency issues due to high viscosity.
Innovation Solution
A high-purity epoxy compound product with a purity of 90% or greater, containing specific impurities in a total content proportion of 10 mass% or less, and a Hazen color number of 105 or less, produced through epoxidation, low-boiling fraction removal, and high-boiling fraction removal processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If 3,4-epoxy-6-methylcyclohexylmethyl(3',4'-epoxy-6'-methyl)cyclohexane carboxylate is used to achieve low curing shrinkage, then curing shrinkage resistance is improved, but purity is low and heat resistance and transparency of cured product deteriorate
Solution Approach 1:
The patent applies extraction through fractional distillation to separate the desired high-purity epoxy compound from impurities in the reaction mixture. By controlling the distillation process and collecting fractions at specific temperature ranges, the patent extracts pure 3,4-epoxy-6-methylcyclohexylmethyl(3',4'-epoxy-6'-methyl)cyclohexane carboxylate while removing impurities that cause poor heat resistance and transparency, thus achieving both high purity and maintained curing shrinkage resistance
Solution Approach 2:
The patent changes the purity parameter of the epoxy compound through controlled fractional distillation. By adjusting temperature parameters during distillation and controlling the collection of fractions within specific temperature ranges, the patent achieves 90% or greater purity while maintaining the desired curing shrinkage resistance properties of the epoxy compound
2Quantity of substance
If low-purity epoxy compound is used to achieve low viscosity, then viscosity is reduced, but heat resistance and transparency of cured product deteriorate
Solution Approach 1:
The patent extracts high-purity epoxy compound through fractional distillation, separating it from impurities that would increase viscosity and degrade heat resistance. The extraction process yields pure compound with appropriate viscosity characteristics while eliminating impurities that cause poor heat resistance and transparency, thus achieving both acceptable viscosity and high heat resistance
Solution Approach 2:
The patent changes the purity parameter through fractional distillation, achieving 90% or greater purity. This purity change results in optimal viscosity characteristics while eliminating impurities that would compromise heat resistance, thus simultaneously improving both viscosity control and heat resistance properties
3Quantity of substance
If low-purity epoxy compound is used to achieve low viscosity, then viscosity is reduced, but transparency of cured product deteriorates
Solution Approach 1:
The patent extracts pure epoxy compound through fractional distillation, removing impurities that cause poor transparency. The extraction process yields high-purity compound with controlled viscosity while eliminating impurities that would reduce transparency, thus achieving both acceptable viscosity and high transparency simultaneously
Solution Approach 2:
The patent changes the purity parameter through controlled fractional distillation, achieving 90% or greater purity. This purity improvement maintains appropriate viscosity while eliminating impurities that would compromise transparency, thus simultaneously achieving low viscosity and high transparency properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The epoxy compound product achieves low viscosity, excellent heat resistance, and transparency, suitable for forming cured products with improved handling properties.
Implementation Method 1
reacting 6-methyl-3-cyclohexenylmethyl(6'-methyl-3'-cyclohexenyl)carboxylate with an organic peracid to produce a reaction product
Implementation Method 2
the low-boiling fraction removal includes subjecting the reaction product to a low-boiling fraction removal treatment
Implementation Method 3
the high-boiling fraction removal includes subjecting the reaction product to a high-boiling fraction removal treatment through thin film evaporation
Data Source
Figure 1
AI summary
Provided is a low-viscosity epoxy compound product that is not susceptible to curing shrinkage and can be used to form a cured product excelling in heat resistance and transparency. In the epoxy compound product according to the present disclosure, the purity of a compound represented by Formula (1) below is 90% or greater, and the total content proportion of a compound represented by Formula (a) below, a compound represented by Formula (b) below, a compound represented by Formula (c) below, and a compound represented by Formula (d) below is 10 mass% or less.