High Resistivity Layer Measurement Using Microscopic Probe and Equivalent Circuit

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Solution Overview

Problem

Measuring the resistance area product of a high resistivity layer in a multilayer test sample is challenging due to difficulties in establishing an electric connection using conventional probes, which are either too large or damage the sample, and existing methods are unsuitable for samples with high resistivity layers lacking ohmic transport.

Innovation Solution

A three-layer structure is created by adding an electrically conducting top layer to the test sample, with a microscopic multi-point probe used to measure voltages and resistances, employing an equivalent circuit model to determine the resistance area product, where the interface layer has negligible electron transport by quantum tunneling, allowing for reliable measurements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a macroscopic probe is used to measure the high resistivity layer, then the electric connection is easier to establish, but the probe contact points are too large or may damage the sample

Engineering Contradiction:
Improveelectric connection reliabilityVSAvoidsample damage
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The invention changes the key parameter of probe size from macroscopic to microscopic scale, enabling contact with high resistivity layers without damaging the sample while maintaining measurement capability through the developed equivalent circuit model

Inventive Principle:
Principle #35Parameter changes

2Object-affected harmful factors

If a microscopic multi point probe is used to measure the high resistivity layer, then the sample is not damaged, but establishing an electric connection is difficult

Engineering Contradiction:
Improvesample damageVSAvoidelectric connection reliability
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The invention introduces an equivalent circuit model as an intermediary that mathematically relates the difficult-to-measure high resistivity layer properties to the easily measurable voltages and currents at the probe contacts, enabling reliable measurement without direct electrical contact with the high resistivity material

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If quantum tunneling transport is present in the interface layer, then electron transport occurs, but the measurement signal is masked by measurement noise

Engineering Contradiction:
Improveelectron transportVSAvoidmeasurement signal-to-noise ratio
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The invention changes the thickness parameter of the interface layer to be sufficiently large, which suppresses quantum tunneling effects and enables ohmic transport dominance, thereby achieving a measurable signal that exceeds the noise floor while maintaining physical realism

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate determination of the resistance area product in high resistivity layers by masking measurement noise and providing reliable process monitoring in multilayer stacks, improving measurement sensitivity and reliability.

Implementation Method 1

the interface layer substantially constitutes an ohmic conductor and electron transport through the interface layer by means of quantum tunneling is negligible

Methodology Applied
Scientific EffectOhmic conduction: Conduction (electrical)

Implementation Method 2

electron transport through the interface layer by means of quantum tunneling is negligible (e.g., less than 1% of the total transport of electrons through the interface layer)

Methodology Applied
Scientific EffectQuantum tunneling:

Data Source

PatentUS11946890B2Method for measuring high resistivity test samples using voltages or resistances of spacings between contact probes
Publication Date: 2024.04.02 KLA CORP
  • US11946890B2 patent drawing
  • US11946890B2 patent drawing

AI summary

To measure the resistance area product of a high resistivity layer using a microscopic multi point probe, the high resistivity layer is sandwiched between two conducting layers. A plurality of electrode configurations/positions is used to perform three voltage or resistance measurements. An equivalent electric circuit model/three layer model is used to determine the resistance area product as a function of the three measurements.