High-Resolution Display Color Conversion Without LED Transfer
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Solution Overview
Problem
The manufacturing of high-resolution display apparatuses requires highly efficient compact LED chips and a difficult transfer technique to arrange them at appropriate positions, which is challenging due to the small pixel size and exposure of active layers, leading to reduced light efficiency and accurate placement issues.
Innovation Solution
A method of manufacturing a display apparatus where a color conversion layer is formed using light emission from the display apparatus itself, involving monolithic formation of an emissive layer, driving layer, and color conversion layers without a transfer operation, and patterning these layers using exposure lines and signals to form pixels with a size of 500 ppi or more.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If compact LED chips are used to achieve high-resolution display, then pixel density is improved, but transfer technique difficulty and placement accuracy worsen
Solution Approach 1:
The patent merges the LED chip formation and color conversion layer formation into a single monolithic structure grown on one substrate. This eliminates the need for separate transfer operations of compact LED chips, resolving the technical contradiction by achieving high pixel density through integrated growth rather than complex transfer techniques.
Solution Approach 2:
The patent segments the display into multiple pre-display areas on a single substrate, each with its own LED chips and color conversion layers. This segmentation allows high-resolution display to be achieved through distributed integration rather than transferring individual compact chips, reducing transfer technique difficulty while maintaining pixel density.
2Manufacturing precision
If compact LED chips are used to achieve high-resolution display, then pixel size is reduced, but light efficiency worsens due to exposure of active layers
Solution Approach 1:
The patent merges the color conversion layers directly with the LED chips in a monolithic structure, eliminating exposed active layers between components. This integration prevents light loss while maintaining small pixel sizes, resolving the contradiction between reduced pixel size and maintained light efficiency.
3Manufacturing precision
If transfer technique is used to arrange LED chips, then placement accuracy is required, but manufacturing complexity increases
Solution Approach 1:
The patent merges LED chip formation and color conversion layer formation into simultaneous monolithic growth processes. This eliminates separate transfer operations and placement steps, resolving the contradiction by achieving placement accuracy through integrated manufacturing rather than complex transfer techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for easy manufacturing of high-resolution displays with increased light efficiency and improved pixel accuracy by eliminating the need for transfer operations and enhancing color quality and contrast.
Implementation Method 1
a color conversion layer is formed using light emission from the display apparatus itself
Data Source
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AI summary
Provided are a method of manufacturing a display apparatus and the display apparatus. The method includes forming an emissive layer and a driving layer on a first area of a substrate, forming an exposure line electrically connected to the driving layer, on a second area of the substrate, and forming a color conversion layer on the driving layer by emitting light from the emissive layer using the exposure line.