High-Silicon Photocurable Composition Without Phase Separation
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Solution Overview
Problem
Photocurable compositions with silicon content greater than 15 wt % are not stable due to phase separation, which is a challenge for sub-20 nm CD device fabrication in inkjet adaptive planarization (IAP) and nanoimprint lithography (NIL), requiring compositions with high stability, low viscosity, and high curing speed.
Innovation Solution
Incorporation of a non-fluorine-containing acetylenic diol as a release agent in a photocurable composition, along with silicon-containing monomers, to achieve a silicon content of at least 15 wt % while maintaining stability and low viscosity, using specific monomers and optional additional release agents to adjust contact angles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If silicon content in photocurable composition is increased to achieve high etch resistance, then etch resistance is improved, but stability deteriorates due to phase separation
Solution Approach 1:
The patent changes the chemical composition parameters by introducing specific silicon-containing monomers with controlled molecular structures (formula 1) and adjusting silicon content to 15-30 wt%, while also modifying the release agent composition to achieve both high etch resistance and stability
Solution Approach 2:
The patent creates a composite photocurable composition combining specific silicon-containing monomers (formula 1) with non-fluorine-containing release agents (formula 2 or 3) and photoinitiators, achieving synergistic effects that provide both high etch resistance and stability
2Strength
If silicon content is increased to achieve high etch resistance, then etch resistance is improved, but viscosity increases
Solution Approach 1:
The patent optimizes the molecular weight and structure of silicon-containing monomers (formula 1) to control viscosity while maintaining high silicon content (15-30 wt%), achieving the right balance between etch resistance and processability
3Ease of operation
If conventional release agents are used in high silicon content composition, then release function is achieved, but phase separation occurs
Solution Approach 1:
The patent changes the chemical structure of release agents from conventional fluorine-containing compounds to non-fluorine-containing acetylenic diols (formula 2 or 3) with specific molecular weights and structures that are compatible with high silicon content compositions
Solution Approach 2:
The patent develops a composite release agent system combining non-fluorine-containing acetylenic diols with silicon-containing monomers, creating a stable composite material that provides release function without causing phase separation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high stability with a stability factor of at least 14 days, low viscosity below 30 mPa·s, and enables formation of photo-cured layers with high etch resistance suitable for sub-20 nm CD device fabrication.
Implementation Method 1
a photocurable composition can comprise a polymerizable material, a non-fluorine-containing release agent, and a photoinitiator
Data Source
AI summary
A photocurable composition can comprise a polymerizable material, a non-fluorine-containing release agent, and a photoinitiator, wherein the polymerizable material may comprise at least one silicon-containing monomer having a structure of formula (1)with R1, R2: —O—Si(CH3)3, or alkyl, or aryl, or alkylaryl; R3, R4: —O—Si(CH3)3, alkyl, or aryl, or alkylaryl; R5: C1-C5-alkyl, or aryl, or alkylaryl; R6: —R5-X, or X, or —O—Si(CH3)3, or alkyl, or aryl, or alkylaryl; X: acrylate or methacrylate; and n: 0-4. The amount of silicon (Si) in the photocurable composition can be at least 15 wt % based on the total weight of the polymerizable material, and the non-fluorine-containing release agent may be an acetylenic diol. The photocurable composition can have a high stability with a stability factor of at least 14.