High-Speed Electrical Connector Mounting Interface for 70 GHz Signal Integrity
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Solution Overview
Problem
Existing electrical connectors face challenges in maintaining signal integrity and reducing crosstalk at high frequencies, which affect the speed and efficiency of signal transmission.
Innovation Solution
A mounting interface for electrical connectors is designed with specific substrate configurations, including angled signal vias and conductive traces, along with a ground layer and antipads, to minimize impedance changes and crosstalk, enabling operation up to 70 GHz.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional connector mounting interfaces are used, then manufacturing and assembly are simpler, but signal integrity deteriorates at high frequencies due to impedance changes and crosstalk
Solution Approach 1:
The patent applies local quality by creating a transition region with specific local structural features (angled signal vias, conductive traces, ground layers, antipads) that differ from the rest of the connector interface. This localized modification optimizes impedance control and reduces crosstalk specifically at the mounting interface where signals transition between connectors and the printed circuit board, without requiring changes throughout the entire connector structure.
Solution Approach 2:
The patent utilizes another dimension by introducing angled signal vias that extend at angles relative to the mounting interface surface, and by creating a multi-layer transition region with conductive traces and ground layers at different depths. This three-dimensional approach allows for better impedance control and signal isolation compared to conventional planar mounting interfaces.
2Productivity
If signal transmission speed is increased to achieve higher data rates, then productivity improves, but signal integrity worsens due to increased susceptibility to crosstalk and impedance changes
Solution Approach 1:
The patent applies preliminary action by designing the transition region with pre-configured angled signal vias, conductive traces, and ground layers that proactively control impedance and reduce crosstalk before high-frequency signals are transmitted. This preemptive structural design ensures signal integrity is maintained from the outset of signal transmission, enabling higher data rates without compromising reliability.
Solution Approach 2:
The transition region acts as an intermediary between the connector and the printed circuit board, with conductive traces and ground layers serving as mediator elements that smoothly transition signals while controlling impedance and isolating adjacent signals. This intermediary structure reduces direct coupling between signals, thereby reducing crosstalk and enabling higher transmission rates with maintained signal integrity.
3Area of stationary object
If connector density is increased to reduce system size, then area reduction is achieved, but crosstalk between adjacent connectors increases
Solution Approach 1:
The patent applies segmentation by dividing the mounting interface into distinct regions with individual transition structures for each connector signal. Each signal has its own angled via and trace path, and ground layers are segmented to provide isolation between adjacent signals. This segmentation reduces electromagnetic coupling between adjacent connectors, thereby reducing crosstalk while allowing higher connector density.
4Ease of manufacture
If conventional right angle connector configurations are used, then ease of manufacture is maintained, but impedance control and crosstalk reduction are insufficient at high frequencies
Solution Approach 1:
The patent applies parameter changes by modifying the geometric parameters of the mounting interface, specifically the angles of signal vias relative to the mounting surface, the dimensions and positioning of conductive traces, and the configuration of ground layers and antipads. These parameter modifications optimize impedance control and reduce crosstalk while remaining compatible with standard manufacturing processes for printed circuit boards.
Data Source
AI summary
Described herein are mounting interfaces for electrical connectors capable of supporting high speed signals and having high density, including up to 70 GHz and higher. Some embodiments provide a connector footprint for a substrate having a pair of signal contact pads on a surface of the substrate and a pair of connecting traces that are interior to the substrate and electrically couple the signal contact pads to a first pair of signal vias (e.g., to a routing layer of the substrate). In some embodiments, a second pair of signal vias may electrically couple the signal contact pads to the connecting traces interior to the substrate. In some embodiments, a portion of a ground layer of the substrate may separate the signal contact pads in the pair. Mounting interfaces described herein enable operation at high frequencies without resonances or other degradation of signal integrity.