High-Speed Connector Interface With Edge-to-Pad PCB Transition
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electrical connectors face challenges in supporting high-speed signals with high density while maintaining signal integrity and efficient routing, often experiencing resonances and mode conversion that degrade performance.
Innovation Solution
The development of electrical connectors with individually shielded modules and a mounting interface that includes signal conductors with compliant portions, aligned edge-to-pad connections, and efficient routing channels to maintain signal integrity and reduce mode conversion, enabling operation at frequencies up to 56 GHz with data transmission rates of 112 Gb/s.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electrical connectors use high density signal conductor arrangements to support high-speed signals, then data transmission rate and bandwidth are improved, but resonances and mode conversion occur that degrade signal integrity
Solution Approach 1:
The connector is divided into multiple individually shielded modules, each containing specific signal conductors. This segmentation isolates high-speed signals within dedicated modules with surrounding shields, preventing resonances and mode conversion between adjacent signal paths while maintaining high density arrangements capable of 112 Gb/s transmission rates
Solution Approach 2:
Ground shields are introduced as intermediary elements between signal conductors. These shields act as mediators that control electromagnetic field distribution, prevent mode conversion, and reduce crosstalk between adjacent signal paths, thereby maintaining signal integrity at high data transmission rates
2Reliability
If electrical connectors use complex shielding and routing structures to maintain signal integrity, then signal quality is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
Multiple functional elements are merged into integrated modules: signal conductors, individual shields, ground references, and routing channels are combined into standardized connector modules. This merging reduces overall device complexity by eliminating the need for separate components while maintaining signal integrity through the integrated shielded structure
Solution Approach 2:
The connector modules are designed with universal interfaces and standardized configurations that can support multiple signal rates including high-speed 112 Gb/s transmission. The same modular structure with individual shields and ground references serves both high-speed and lower-speed applications, reducing complexity by avoiding specialized designs for different performance levels
Data Source
AI summary
An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.