Three-Interface High-Speed Connector Layout for Tight Server Space
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Solution Overview
Problem
Existing electrical connectors face challenges in efficiently connecting multiple substrates with high-speed data channels while adhering to physical and dimensional constraints, particularly in systems with limited space, such as servers and routers, where data transmission rates exceed 10 Gigabit/sec.
Innovation Solution
A compact high-speed electrical connector design featuring multiple interfaces, including a mounting interface and two mating interfaces, with conductive elements configured to support high-speed and low-speed signal transmission, and a shielding mechanism to reduce crosstalk, allowing direct interconnections between substrates while optimizing space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional card edge connector with two columns of mating contacts is used, then the connector can support basic electrical connections, but it cannot efficiently connect multiple substrates with high-speed data channels while adhering to physical and dimensional constraints
Solution Approach 1:
The patent transitions from a conventional two-column mating contact arrangement to a three-column configuration with interfaces distributed across multiple sides of the connector. This spatial reorganization allows the connector to mate with multiple substrates simultaneously in different directions, enabling high-speed data channel connections while maintaining compact dimensions that fit within physical and dimensional constraints.
Solution Approach 2:
The connector is designed with multiple interfaces (first, second, and third interfaces) that can simultaneously support high-speed and low-speed signal transmission. The first interface connects to a first substrate, the second interface connects to a second substrate, and the third interface connects to a third substrate, allowing a single connector to perform multiple connection functions and support various data transmission rates within a compact form factor.
2Productivity
If multiple interfaces are added to support high-speed data transmission, then data transmission capability is improved, but connector complexity increases
Solution Approach 1:
The connector is divided into distinct interfaces (first interface, second interface, third interface) with dedicated conductive elements for different signal types. High-speed signal conductive elements are separated from low-speed signal conductive elements, allowing each interface to be optimized for its specific function while maintaining overall connector integration. This segmentation enables high-speed data transmission capabilities without requiring complete redesign of the entire connector structure.
3Reliability
If conductive elements are arranged to support high-speed signals, then signal integrity is improved, but crosstalk between adjacent conductive elements increases
Solution Approach 1:
Ground conductive elements are positioned between adjacent high-speed signal conductive elements to act as shielding intermediaries. These ground elements create electrical barriers that prevent electromagnetic interference and crosstalk between neighboring signal conductors, thereby maintaining signal integrity for high-speed data transmission while allowing close spacing of conductive elements within the connector structure.
Data Source
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AI summary
A compact high-speed electrical connector and electronic system thereof. The connecter comprises first, second, and third mating interfaces configured to receive one or more cards, and a mounting interface configured to mount to a substrate. The first, second, and third mating interfaces extend in columns parallel to each other and perpendicular to a mating direction. The first, second, and third mating interfaces offset from each other in a mating direction. The mounting interface extends in the mating direction. Such a configuration enables direction interconnections between three components that support hybrid functions such as high-speed signals, power, and/or side bands, while satisfying a limited space provided by an electronic system.