High-speed RF connector multi-shield design
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Solution Overview
Problem
Current high-speed electrical interconnects face challenges in minimizing cross-talk and maintaining low insertion loss across a wide frequency range, particularly at high frequencies like 75 GHz, due to limitations in shielding and impedance matching.
Innovation Solution
The electrical connector system employs a multi-shielded design with a sealing gasket and a third auxiliary shield to reduce cross-talk and improve impedance matching, using a coaxial substrate with SMT pads and methods to adjust solder ball shape and size for optimal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional shielding designs are used, then device complexity is reduced, but cross-talk increases and shielding effectiveness decreases at high frequencies
Solution Approach 1:
The patent implements a nested shield configuration where an inner shield surrounds each signal conductor, and an outer shield encloses the entire assembly. The inner shields are positioned within the outer shield, creating multiple concentric shielding layers that progressively block electromagnetic interference and reduce cross-talk between adjacent conductors at high frequencies
Solution Approach 2:
The shielding structure is segmented into multiple independent shields (inner shields for each conductor and an outer shield) rather than using a single continuous shield. This segmentation allows each shield to independently manage electromagnetic fields for specific conductors, improving overall shielding effectiveness while maintaining manageable complexity
2Loss of energy
If conventional connector designs are used, then manufacturing simplicity is maintained, but insertion loss increases at frequencies above 75 GHz
Solution Approach 1:
The patent modifies geometric parameters of the connector components, including the dimensions and positioning of shields, conductors, and dielectric elements, to optimize impedance matching and minimize insertion loss at high frequencies. These parameter adjustments are designed to maintain compatibility with standard manufacturing processes while achieving superior high-frequency performance
3Reliability
If impedance matching is not optimized, then manufacturing simplicity is maintained, but signal integrity deteriorates at high frequencies
Solution Approach 1:
The patent employs composite structures combining conductive materials for shields and conductors with dielectric materials for insulation and mechanical support. This composite approach enables precise control of impedance characteristics through material property selection and geometric configuration, achieving excellent signal integrity at high frequencies while managing structural complexity
Data Source
AI summary
A high-speed electrical RF, single-ended, or differential/twin axial electrical connector, capable of at least 67 GHz of operable bandwidth. The electrical connector can include at least one signal conductor that is supported by a connector housing that, in turn, is received by an electrical shield. Two such electrical connectors are configured to mate with each other, such that a third electrical shield at least partially surrounds and contacts each of the first and second electrical shields, thereby placing the electrical shields in electrical communication with each other.