High-Temperature Electronic Chassis Thermal Management
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Solution Overview
Problem
Electrical components in high-temperature environments, such as jet engines, face cooling challenges due to excessive external heat generation, leading to performance issues and premature failure from thermal cycling, as conventional cooling methods are inadequate and constrained by space and weight limitations.
Innovation Solution
An electrical chassis with a substrate made of low thermal conductivity materials like thermally resilient polymers, combined with a reflective layer and a heat sink cooled by a fluid, which minimizes heat absorption from the environment and focuses on removing heat generated by the components themselves, while reducing thermal cycling and cabling requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling methods (conduction or convection) are used for electrical components in high-temperature environments, then cooling effectiveness is improved, but space and weight constraints are worsened
Solution Approach 1:
The patent introduces a thermally resistant polymer substrate as an intermediary material between the electrical components and the high-temperature environment. This substrate acts as a thermal barrier that protects components from external heat while allowing controlled heat dissipation, eliminating the need for heavy conventional cooling systems.
Solution Approach 2:
The patent employs composite material structures combining the thermally resistant polymer substrate with metal heat sinks and reflective layers. This composite approach creates a lightweight yet effective thermal management system that provides both insulation and active cooling where needed.
2Object-affected harmful factors
If insulation is added to protect electrical components from external heat, then thermal protection is improved, but the environment makes proper insulation infeasible
Solution Approach 1:
The patent changes the thermal parameters of the substrate material by selecting a thermally resistant polymer with specific thermal conductivity properties. This material has low thermal conductivity to block external heat while maintaining structural integrity at high temperatures, making insulation feasible in previously unsuitable environments.
Solution Approach 2:
The patent applies different thermal properties to different parts of the system: the substrate provides thermal insulation, while heat sinks provide localized heat dissipation. This local differentiation of thermal management strategies allows the system to simultaneously protect from and dissipate heat as needed.
3Temperature
If electrical components are cooled by conduction using heat sinks, then cooling effectiveness is improved, but the ambient temperature generates more heat than the components themselves
Solution Approach 1:
The patent extracts the thermal insulation function from the traditional cooling system by using the thermally resistant polymer substrate to block external heat before it reaches the components. This separates the protection function from the active cooling function, allowing the heat sink to focus only on component-generated heat.
Solution Approach 2:
The patent converts the thermally resistant polymer's low thermal conductivity, which initially seems to trap heat, into a benefit by using it to block external heat sources. This allows the system to leverage the same material property for both insulation and controlled thermal management.
4Loss of energy
If conventional substrate materials with high thermal conductivity are used, then heat dissipation is improved, but thermal cycling and premature failure are worsened
Solution Approach 1:
The patent inverts the traditional approach by using low thermal conductivity material for the substrate instead of high thermal conductivity material. This reversal protects components from external thermal cycling while the heat sink handles internal heat dissipation, improving reliability without sacrificing thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains an acceptable operating temperature for electrical components in high-temperature environments, reducing thermal cycling and extending component lifespan, and minimizes the need for extensive cabling and wiring by strategically locating the electrical chassis near heat sources, thus enhancing system efficiency and reliability.
Implementation Method 1
A reflective layer is disposed on an outer surface of the housing
Implementation Method 2
a heat sink is coupled to the substrate, the heat sink being cooled by a fluid
Implementation Method 3
The substrate material having properties of low thermal conductivity and low electrical conductivity
Data Source
AI summary
An electrical chassis for use in high temperature environments is disclosed. The electrical chassis may be employed, for example, in close proximity to the combustion chamber of a jet engine. The electrical chassis is constructed with a substrate formed from a material with low thermal conductivity and low electrical conductivity, such as polyetheretherketone. A reflective surface may be disposed on a housing containing the substrate to reduce the absorption of radiation. A heat sink and fluid inlet and outlet may also be arranged to remove heat generated by the electrical components.