High-Temperature Flexible Printed Circuit With SMT Mounting
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Solution Overview
Problem
Conventional flexible printed circuit boards have limitations in size, high manufacturing costs, and complexity due to their production processes, and they are not suitable for high-temperature environments or flexible mounting on devices.
Innovation Solution
A flat flexible printed circuit made from high-temperature-resistant film materials, manufactured via a roll-to-roll lamination process, with conductors sandwiched between films, allowing for branching, bending, and electrical connection to external devices through perforated terminals and connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional flexible printed circuit boards are used, then flexibility is achieved, but manufacturing cost increases and manufacturing complexity increases
Solution Approach 1:
The patent changes the material parameter from conventional FPCB materials to high-temperature-resistant film materials, and changes the manufacturing process parameter from complex multi-step processes to simplified lamination processes, thereby reducing manufacturing cost while maintaining flexibility
Solution Approach 2:
The patent uses composite material structure consisting of high-temperature-resistant film combined with conductive materials to achieve both flexibility and high-temperature resistance, while the lamination process integrates multiple functions into a single manufacturing step, reducing overall manufacturing complexity
2Ease of operation
If conventional flexible printed circuit boards are used, then flexibility is achieved, but manufacturing process complexity increases
Solution Approach 1:
The patent merges multiple manufacturing steps into a single lamination process, where the high-temperature-resistant film is laminated with conductive materials in one operation, thereby achieving flexibility while significantly reducing manufacturing process complexity
3Reliability
If conventional flexible printed circuit boards are used, then signal transmission is achieved, but reliability in high-temperature environments deteriorates
Solution Approach 1:
The patent changes the material parameter to high-temperature-resistant film materials, which maintain structural integrity and electrical properties at elevated temperatures, thereby ensuring signal transmission reliability in high-temperature environments
4Volume of moving object
If film materials are used to wrap conductors, then volume decreases and weight decreases, but manufacturing precision requirements increase
Solution Approach 1:
The patent uses thin film materials to wrap conductors, which significantly reduces circuit volume and weight. The lamination process is designed to accommodate typical manufacturing tolerances, ensuring that the required precision level is achievable with standard manufacturing capabilities
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable electrical signal transmission in high-temperature environments, reduces manufacturing costs, and provides flexibility and versatility in device mounting and connection, enhancing usability and economic viability.
Implementation Method 1
a first film, a plurality of conductors provided on one surface of the first film, and a second film which faces the first film in a state in which the plurality of conductors are interposed between the first film and the second film, and is adhered to the first film
Data Source
AI summary
Embodiment relates to a flat flexible printed circuit and, more specifically, to a flat flexible printed circuit which is flexible, due to the inclusion of films, and on which a surface mount technology (SMT) terminal can be mounted. According to the embodiment, the flat flexible printed circuit includes a film material capable of withstanding high temperatures, and thus can be electrically connected to an external device in a high-temperature environment and, as a result, is highly versatile.