High-Temperature Sensor Assembly Using Wide Bandgap Buffering
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Solution Overview
Problem
Existing high-temperature, high-impedance sensor assemblies face reliability and cost issues due to the need for auxiliary cooling devices and mineral insulated cables in extreme environments, which increase complexity and cost, and limit operational temperature and durability.
Innovation Solution
A sensor assembly with a wide bandgap semiconductor buffering circuit integrated within an outer housing, eliminating the need for auxiliary cooling systems and MI cables by maintaining electronic devices and sensors in a shielded environment, using materials like silicon carbide or alumina substrates to operate effectively from -55°C to 600°C continuously.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If auxiliary cooling devices are used to enable electronic devices to operate in high-temperature environments, then the operating temperature range is extended, but the device complexity and cost increase
Solution Approach 1:
The invention extracts and eliminates the auxiliary cooling devices from the sensor assembly by using wide bandgap semiconductor materials that inherently operate at high temperatures without requiring active cooling systems
Solution Approach 2:
The invention changes the material parameter of the semiconductor devices from conventional silicon to wide bandgap materials (such as silicon carbide or gallium nitride), which have higher breakdown voltages and can operate at elevated temperatures up to 600°C without auxiliary cooling
2Reliability
If mineral insulated cable is used to connect electronic devices to sensing elements in high-temperature environments, then the cable durability and robustness are improved, but the installation difficulty and cost increase
Solution Approach 1:
The invention extracts and eliminates the mineral insulated cable from the system by integrating the buffering circuit and electronic devices directly within the sensor assembly housing, removing the need for external cable connections
Solution Approach 2:
The invention merges the sensing element, buffering circuit, and electronic devices into a single integrated sensor assembly housed together, eliminating the need for separate cable connections and reducing installation complexity
3Reliability
If electronic devices are separated from sensing elements to protect them from high temperatures, then the electronic device reliability is improved, but the signal-to-noise ratio deteriorates and installation cost increases
Solution Approach 1:
The invention changes the temperature resistance parameter of the electronic devices by using wide bandgap semiconductor materials that can operate reliably at high temperatures, allowing the devices to be positioned close to the sensing element without thermal damage
Solution Approach 2:
The invention merges the electronic devices with the sensing element in the same housing, maintaining close proximity for optimal signal-to-noise ratio while protecting both components through the use of high-temperature-capable materials and thermal management design
Data Source
AI summary
A sensor assembly includes an outer housing and at least one high-impedance sensing device positioned within the outer housing. The sensor assembly also includes a buffering circuit having at least one wide bandgap semiconductor device positioned within the outer housing. The buffering circuit is operatively coupled to the at least one high-impedance sensing device.