High-Temperature Susceptor Structure for Stable Adhesion and Zonal Cooling
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Solution Overview
Problem
Conventional electrostatic chucks face issues with adhesive deterioration and thermal stress due to high temperatures, and AlN's high thermal conductivity makes temperature control difficult in high-temperature semiconductor processes.
Innovation Solution
A susceptor structure with a non-adhesive design using AlN as a ceramic material, combined with a thermal insulation member and a base member, allows for independent temperature control of multiple heating zones and suppresses junction deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If organic adhesive materials such as silicone are used to bond the ceramic insulating plate and metal base, then the assembly is easy to manufacture, but the adhesive deteriorates and decomposes at high temperatures of 300°C or higher, making it impossible to maintain adhesion
Solution Approach 1:
The patent removes the adhesive layer entirely from the bonding structure. The insulating plate and base are bonded directly through mechanical interference fit and thermal expansion differential locking, eliminating the organic adhesive material that decomposes at high temperatures. This extraction of the problematic adhesive component resolves the contradiction by maintaining reliability at high temperatures while preserving manufacturability through simplified direct bonding.
Solution Approach 2:
The patent replaces the disposable organic adhesive with a permanent metallic bonding structure. The direct metal-to-ceramic bonding creates a durable, reusable connection that withstands repeated high-temperature cycling without degradation, eliminating the need for adhesive replacement or rebonding.
2Ease of manufacture
If conventional adhesive layers are used between the base and insulating plate, then the structure is simple to manufacture, but very large stress is generated in the adhesive layer during high-temperature processes due to high difference in coefficient of thermal expansion between ceramic and metal base
Solution Approach 1:
The adhesive layer is completely removed from the structure. The bonding interface between the metal base and ceramic insulating plate is achieved through direct contact and mechanical interference, eliminating the adhesive layer that would otherwise experience and concentrate thermal stresses from coefficient of thermal expansion mismatch.
Solution Approach 2:
The patent changes the bonding mechanism from chemical adhesion to mechanical interference fit combined with thermal expansion differential locking. The interference fit creates initial compressive stress, and the differential thermal expansion between metal and ceramic generates additional locking force at operating temperature, transforming the stress state to prevent separation.
3Temperature
If AlN material with high thermal conductivity is used as ceramic material to increase temperature control capability, then thermal conductivity is improved, but it becomes impossible to control temperature by defining separate heating regions within the electrostatic chuck
Solution Approach 1:
The patent divides the heating system into multiple independent heating zones with separate heating elements and temperature control systems. Each zone can be controlled independently despite the high thermal conductivity of AlN, allowing precise temperature management across different regions of the susceptor for complex semiconductor processing requirements.
Solution Approach 2:
The patent implements different thermal management strategies for different regions of the susceptor. By using segmented heating zones with independent control, each region can be optimized for its specific processing requirements, creating local thermal quality variations despite the homogeneous high thermal conductivity material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The susceptor effectively maintains adhesion and temperature control in high-temperature processes, reducing thermal stress and enabling precise temperature management.
Implementation Method 1
a first cooling gas flow path configured to introduce a cooling gas
Implementation Method 2
Cooling gas introduced through a cooling gas flow path in the base 20 flows through gas holes 12 of the insulating plate 10
Implementation Method 3
a thermal insulation member having a thermal conductivity of 20 W/mK or less, the thermal insulation member including a second cooling gas flow path
Implementation Method 4
a representative example of the susceptor is an electrostatic chuck (ESC) that uses electrostatic force to fix a substrate
Data Source
AI summary
The present disclosure provides a susceptor. The susceptor includes: a base member including a first cooling gas flow path configured to introduce a cooling gas; a thermal insulation member having a thermal conductivity of 20 W/mK or less, the thermal insulation member including a second cooling gas flow path in communication with the first cooling gas flow path and being stacked on the base member; and an insulating plate stacked on the thermal insulation member, the insulating plate including a plurality of gas holes in communication with the second cooling gas flow path and configured to discharge the cooling gas to cool a substrate.