Monolithic High-Temperature Sensor for Thermal Expansion Mismatch
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing sensors for high-temperature, high-vibration environments, such as those in gas turbines, are prone to failure due to stresses caused by differing thermal coefficients of expansion and thermal transfer rates among components, leading to reduced durability and shorter expected time to failure.
Innovation Solution
A method of additive manufacturing that deposits alternating layers of electrically insulating and conductive materials to form a monolithic structure, where the insulating material shields the conductive components from the external environment, reducing thermal stresses and enhancing durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If discrete parts are used to manufacture sensors for high-temperature environments, then the sensor can be assembled from separate components, but the durability is reduced due to stresses from differing thermal coefficients of expansion
Solution Approach 1:
The patent merges multiple discrete components (electrode, insulator, housing) into a single monolithic structure formed by additive manufacturing. This eliminates the interfaces between components that would otherwise experience thermal stress due to differing coefficients of thermal expansion, thereby resolving the contradiction between ease of manufacture and reliability.
Solution Approach 2:
The patent uses composite materials with matched thermal properties in the additive manufacturing process to create a monolithic sensor structure. By selecting materials with compatible thermal expansion characteristics and fusing them at the molecular level during printing, the sensor achieves high durability while maintaining manufacturing efficiency.
2Ease of manufacture
If discrete components are assembled to form the sensor, then manufacturing flexibility is improved, but thermal stresses cause earlier failure
Solution Approach 1:
The patent combines multiple functional components into a single monolithic structure printed via additive manufacturing. This eliminates thermal stress interfaces while maintaining the functional distinctions of electrode, insulator, and housing regions, thus improving time to failure without sacrificing manufacturing flexibility.
Solution Approach 2:
The patent changes the manufacturing parameter from discrete assembly to continuous additive deposition. This fundamental parameter change allows the sensor to be manufactured as a monolithic structure with optimized material distribution, eliminating thermal stress while preserving design flexibility through digital modeling.
3Ease of manufacture
If conventional manufacturing methods are used, then the sensor can be produced with separate components, but the sensor is prone to damage from thermal and vibrational environments
Solution Approach 1:
The patent merges separate components into a monolithic structure that resists thermal and vibrational damage. The continuous material structure eliminates weak interfaces where damage would initiate, while additive manufacturing allows optimization of material placement to enhance resistance to harmful environmental factors.
Solution Approach 2:
The patent changes the manufacturing approach from conventional discrete production to additive monolithic fabrication. This parameter change creates a sensor structure inherently more resistant to thermal and vibrational damage while maintaining production efficiency through automated printing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in sensors with improved durability and extended lifespan in harsh environments by eliminating stresses from thermal expansion differences and protecting the conductive components from external damage.
Implementation Method 1
The electrically insulating material is deposited such that the at least one elongate portion is shielded from the external environment
Implementation Method 2
The differing coefficients of thermal expansion, thermal transfer rates and thermal masses of each component in the sensor cause stresses within the sensor assembly
Implementation Method 3
depositing one or more electrically conductive material to form at least one further portion of the layer with high electrical conductivity; forming at least one path of high electrical conductivity extending through the layers
Implementation Method 4
fusing the materials to form a monolithic structure
Data Source
AI summary
The present invention relates to a method of manufacturing a sensor for a high-temperature environment. The method comprises the steps of: depositing an electrically insulating material (108) to form at least one portion of a layer (112); depositing an electrically conductive material (110) to form at least one further portion of the layer (112); depositing successive layers (112), each layer being formed of the electrically insulating material (108) and/or the electrically conductive material (110), wherein the electrically conductive material (110) in each layer is deposited on at least a portion of the electrically conductive material (110) in the previous layer so as to form at least one electrically continuous portion extending through the layers; and fusing the materials. The invention further relates to a sensor for a high-temperature environment comprising: at least one electrically conductive portion; and at least one electrically insulating portion, encapsulating the or each electrically conductive portion. The or each electrically conductive portion and the or each electrically insulating portion are fused to form a monolithic body.