High-Throughput 3D Printing Extrusion System

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Solution Overview

Problem

Current additive manufacturing techniques are limited by the design of extruders, liquefiers, and gantries, which restrict extrusion rates due to filament shear area limitations, inadequate heat transfer, and poor dynamic performance, leading to filament shear failure and reduced throughput.

Innovation Solution

A high-throughput extrusion system incorporating a nut feed extruder with a pre-heater and liquefier, where the filament is volumetrically pre-heated to a desired temperature before being extruded onto a build platform, using a motion system to position the nozzle accurately across multiple axes, enhancing extrusion force, heat transfer, and deposition rate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Force

If traditional pinch-wheel extrusion mechanism is used, then filament engagement is provided, but extrusion force is limited by filament shear area causing shear failure

Engineering Contradiction:
Improveextrusion forceVSAvoidfilament shear failure
Core Design Contradiction:
ForceVSReliability

Solution Approach 1:

The patent replaces the traditional mechanical pinch-wheel extrusion mechanism with a die-based extrusion system. The die mechanically engages the filament through threaded features, converting rotational motion into linear extrusion force. This substitution eliminates the shear failure problem by distributing force through a larger engagement area and more efficient mechanical advantage, achieving over 100 pounds of extrusion force without filament damage.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If traditional conduction liquefier is used, then filament heating is provided, but heat transfer rate is inadequate limiting extrusion speed

Engineering Contradiction:
Improveextrusion rateVSAvoidfilament heating rate
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The patent replaces the traditional conduction-based heating liquefier with an infrared radiative heating system. The infrared heater directly radiates thermal energy to the filament, bypassing the need for thermal conduction through the liquefier walls. This enables rapid heating and melting of the filament at high extrusion speeds, achieving complete melting even at extrusion rates exceeding 100 feet per hour.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If traditional gantry system is used, then positioning is provided, but speed and acceleration are limited reducing throughput

Engineering Contradiction:
Improvedeposition rateVSAvoidgantry speed
Core Design Contradiction:
ProductivityVSSpeed

Solution Approach 1:

The patent employs a dynamic gantry system with servo motors that provide precise control over speed, acceleration, and positioning. The system can dynamically adjust motion parameters to match the high extrusion rates, achieving accelerations and speeds that synchronize material deposition with rapid gantry movement, thereby enabling high-throughput operation without sacrificing positioning accuracy.

Inventive Principle:
Principle #15Dynamics

4Productivity

If traditional extrusion system is used, then material deposition is provided, but deposition rate is low limiting production throughput

Engineering Contradiction:
Improvedeposition rateVSAvoidprinting time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The patent implements preliminary action by pre-heating the filament using infrared radiation before it reaches the extrusion die. This pre-heating softens the filament material in advance, reducing the force required for extrusion and enabling faster deposition rates. The system also pre-positions the gantry and prepares the build platform, minimizing idle time between deposition operations and maximizing overall throughput.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system achieves increased deposition rates of up to 200% compared to existing systems while maintaining high accuracy and resolution, capable of processing polymer resins and high-performance thermoplastics for various industrial applications.

Implementation Method 1

A radiative or electrical pre-heater volumetrically heats the filament to a desired temperature

Methodology Applied
Scientific EffectVolumetric heating: Dielectric Heating

Implementation Method 2

The filament is heated to a desired melt temperature in the liquefier, which may rely on conduction heat transfer from the heated liquefier walls

Methodology Applied
Scientific EffectConduction heat transfer: Conduction (thermal)

Implementation Method 3

The extruder and liquefier assembly are directed in the X-Y plane using a gantry to build a cross-section of the part

Methodology Applied
Scientific EffectExtrusion: Extrusion

Data Source

PatentUS10562227B2Systems, devices, and methods for high-throughput three-dimensional printing
Publication Date: 2020.02.18 MASSACHUSETTS INST OF TECH
  • US10562227B2 patent drawing
  • US10562227B2 patent drawing
  • US10562227B2 patent drawing

AI summary

Printing devices and methods are provided that utilize high throughput extrusion to generate a printer material, such as a three-dimensional object. High-throughput extrusion systems as provided volumetrically pre-heat an extruded filament to a desired pre-heat temperature, and then either maintain or heat the extruded filament to a desired melt temperature prior to having the filament extruded out of the system and onto a surface, such as a build platform. By pre-heating the filament prior to heating it to the temperature at which it is excluded, it helps increase the throughput of the system. Likewise, by doing the heating volumetrically, it further helps increase the throughput of the system. Various embodiments of devices and methods typically used for printing in conjunction with the disclosed high throughput systems are also provided.