High Velocity Air Cooling for Electronic Modules
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Solution Overview
Problem
Off-the-shelf electronic modules are not well-suited for harsh operating environments, such as extreme temperatures and dusty conditions, as they are designed for benign conditions, leading to potential overheating and failure.
Innovation Solution
The system includes an electronic module with a housing and air channeling devices that force external air to flow through the module, using a flow device to create a pressure differential and increase air velocity, allowing operation at higher ambient temperatures without exceeding core temperature limits, and incorporates a rugged enclosure and support structure for protection and mobility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If off-the-shelf electronic modules are used, then production and maintenance costs are reduced, but the modules cannot operate reliably in harsh environments with high ambient temperatures
Solution Approach 1:
The system separates the electronic module from the cooling system. The off-the-shelf module remains unchanged while an external cooling apparatus with air channeling devices and flow devices is added, allowing the module to be cooled effectively in harsh environments without modifying the module itself or incurring redesign costs.
Solution Approach 2:
An intermediary cooling system is introduced between the electronic module and the harsh environment. The air channeling devices and flow devices act as intermediaries that manage heat dissipation, enabling the module to operate reliably in high-temperature environments without direct exposure to harsh conditions.
2Ease of manufacture
If off-the-shelf electronic modules are used, then development cost is reduced or eliminated, but the modules are not designed to operate above elevated ambient operating temperatures
Solution Approach 1:
The cooling function is segmented from the electronic module design. By using external air channeling devices and flow devices, the system achieves high-temperature operation capability without requiring the module to be redesp igned or requalified for elevated ambient temperatures, thus eliminating development costs.
Solution Approach 2:
The system changes the operating parameters by introducing forced high-velocity airflow to enhance convective heat transfer. This allows the module to dissipate heat effectively at elevated ambient temperatures without requiring the module itself to be designed for such conditions, maintaining low development costs.
3Device complexity
If standard cooling is used, then the system is simple, but the electronic components reach core temperature above maximum operating temperature when ambient air temperature rises
Solution Approach 1:
The cooling system uses dynamic high-velocity airflow generated by flow devices to adapt to varying thermal loads and ambient temperatures. This dynamic cooling approach maintains core temperatures within operating limits without requiring complex multi-stage cooling systems, balancing simplicity with effectiveness.
Solution Approach 2:
The system uses pneumatic principles by introducing high-velocity air flow through air channeling devices and flow devices to enhance heat dissipation. This pneumatic cooling approach effectively reduces core temperatures of electronic components without requiring complex mechanical cooling systems, maintaining relative simplicity while preventing overheating.
4Ease of manufacture
If off-the-shelf modules are used, then production cost is low, but the modules are not well suited for dusty operating environments
Solution Approach 1:
The air channeling devices and flow devices act as intermediaries that protect the off-the-shelf module from direct exposure to dusty environments. By controlling and directing high-velocity airflow, the system reduces dust ingress while maintaining effective cooling, allowing low-cost modules to operate in harsh dusty conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables electronic modules to operate reliably in harsh environments by enhancing cooling efficiency through high-velocity airflow, preventing overheating, and protecting against dust, thus extending module life and reducing production costs.
Implementation Method 1
The flow device is positioned and configured to produce a pressure differential between the interior of the housing and the exterior of the housing to cause air to flow through the housing
Implementation Method 2
The system still further includes a flow device located exterior to the housing and coupled to the air channeling device. The flow device is positioned and configured to produce a pressure differential between the interior of the housing and the exterior of the housing to cause air to flow through the housing such that the electronic module can be operated in the mode at a second ambient air temperature greater than the maximum rated operating first ambient air temperature
Data Source
AI summary
Systems and methods for cooling electronic components are disclosed herein. Certain aspects of the invention are directed toward an electronic system that includes an electronic module having a container with at least two openings and multiple manufactured electronic components carried in the container. The electronic module is configured to operate reliably at or above a maximum manufacturer's suggested first ambient temperature while still maintaining the first suggested operating core temperature of the internal electronic module. The system further includes a duct in fluid communication with at least one of the openings and an exterior flow device coupled to the duct. The flow device is configured to produce a pressure differential between an interior and an exterior of the container to cause high velocity air to flow through the container such that the electronic module can be operated in the selected mode at a second ambient temperature greater than the maximum first manufacturer's suggested ambient temperature.