High Voltage Assembly for Photon-Counting CT Detectors
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Solution Overview
Problem
The challenge of designing high voltage assemblies for photon-counting multi-spectral CT detectors lies in the difficulty of applying thousand volts of bias voltage across crystalline semiconductor detectors, which requires complex and challenging wiring solutions.
Innovation Solution
A high voltage assembly comprising a base board and sub-detectors with a crystal substrate, a high voltage transfer board, and a cathode board, where connection members allow for elastic contact and adjustment to ensure stable high voltage application across the crystal, utilizing soft conductive materials and Pogo Pin terminals for secure electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional wiring methods are used to apply high voltage to crystalline semiconductor detectors, then the electrical connection can be established, but the system design becomes complex and difficult to implement
Solution Approach 1:
The patent extracts the high voltage connection function from the traditional wiring system and integrates it directly into the detector module structure. The high voltage cathode board and transfer board form an integrated connection system that eliminates complex external wiring, while still achieving reliable thousand-volt bias voltage application across the crystal detector.
Solution Approach 2:
The patent merges the high voltage connection components (cathode board, transfer board, connection members) with the detector structure itself. By combining these functions into a unified integrated assembly, the system achieves both reliable high voltage application and reduced wiring complexity, as the connection is built-in rather than external.
2Reliability
If rigid connection members are used for high voltage connections, then the electrical contact is stable, but the manufacturing tolerances require very high precision
Solution Approach 1:
The patent employs elastic connection members that can dynamically adjust to position variations. These members possess flexibility to accommodate manufacturing tolerances while maintaining stable electrical contact, eliminating the need for extremely tight manufacturing precision requirements that would be necessary with rigid connections.
Solution Approach 2:
The patent changes the mechanical properties of the connection members from rigid to elastic, allowing them to deform and adapt to position variations. This parameter change enables the system to tolerate broader manufacturing variations while maintaining reliable electrical contact, reducing the stringency of manufacturing precision requirements.
3Reliability
If complex wiring solutions are implemented to apply bias voltage, then the high voltage can be applied, but the system design and manufacturing become challenging
Solution Approach 1:
The patent segments the high voltage connection system into modular components (high voltage cathode board, high voltage transfer board, connection members) that can be independently manufactured and then assembled. This segmentation simplifies the manufacturing process for each component while ensuring reliable high voltage application when assembled together, avoiding the need for complex integrated wiring.
Solution Approach 2:
The patent introduces elastic connection members as intermediary elements between the high voltage cathode board and transfer board. These intermediaries facilitate easy assembly and disassembly while maintaining reliable electrical contact, significantly improving ease of manufacture and assembly compared to direct rigid wiring solutions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies the system design, ensures stable high voltage application, reduces manufacturing tolerances, and maintains image quality while avoiding additional buffer layers and complex wiring, thus addressing the challenges of applying high voltage across crystalline semiconductor detectors.
Implementation Method 1
The first connection member is configured to shift relative to the first contact member in response to a first force, and the second connection member is configured to shift relative to the second contact member in response to a second force
Implementation Method 2
the high voltage cathode board is made of a soft conductive material
Data Source
AI summary
High voltage assemblies and detectors are provided. In one aspect, a high voltage assembly includes a high voltage base board and a plurality of sub-detectors. Each sub-detector includes a crystal substrate, a crystal, a high voltage transfer board, and a high voltage cathode board. One of the high voltage transfer board and the high voltage base board includes first and second connection members, and the other one includes first and second contact members. The first connection member is configured to shift relative to the first contact member in response to a first force, and the second connection member is configured to shift relative to the second contact member in response to a second force. A high voltage is applied at both ends of the crystal through electrically contacting the first connection member with the first contact member and electrically contacting the second connection member with the second contact member.