High Voltage LED Lighting Device with Segmented Submount
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Solution Overview
Problem
Conventional high voltage LEDs suffer from poor heat dissipation and light extraction efficiency, as well as unreliable electrical connections, which limit their performance and reliability.
Innovation Solution
A high voltage LED lighting apparatus is designed with a submount and conductive elements to electrically couple LEDs in series, utilizing a sapphire substrate with epitaxially grown III-V compound layers and a multiple quantum well structure for improved heat dissipation and light extraction, and featuring a robust electrical coupling scheme without bond wires or conductive connection layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional high voltage LED structure is used, then high voltage handling capability is achieved, but heat dissipation performance deteriorates
Solution Approach 1:
The device segments the electrical connection function into multiple components: conductive elements within the submount and separate bond wires. This segmentation allows optimization of each component's function, with the submount handling heat dissipation and localized electrical connections, while bond wires provide inter-connectivity between submounts.
Solution Approach 2:
The submount acts as an intermediary component between the LED chip and the external circuitry. It provides both mechanical support and electrical connection functions, while its thermally conductive structure serves as a heat dissipation pathway, mediating between the heat-generating LED and the external environment.
2Temperature
If conventional flip chip LED structure is used, then heat dissipation is improved, but high voltage handling capability and light extraction efficiency deteriorate
Solution Approach 1:
The device applies local quality by providing different functional characteristics at different locations: the submount provides thermal management and localized electrical connections, while the bond wires provide high-voltage inter-connectivity between submounts. This localized functional distribution allows each component to be optimized for its specific purpose.
Solution Approach 2:
The electrical connection system uses a composite approach combining conductive elements (for localized connections within the submount) and bond wires (for inter-submount connections). This composite structure enables the system to handle high voltages while maintaining good electrical connectivity and thermal performance.
3Manufacturing precision
If complex dicing processes are used, then manufacturing precision is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The device is designed with a modular structure where the submount and LED chip are separate components that can be manufactured independently using standard processes. This segmentation allows each component to be fabricated with conventional techniques, avoiding the need for complex integrated dicing processes while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced heat dissipation, increased light extraction efficiency, and a more reliable electrical connection, enabling the LEDs to handle higher voltages while maintaining durability and efficiency.
Implementation Method 1
LEDs are semiconductor photonic devices that emit light when a voltage is applied
Implementation Method 2
sapphire substrate with epitaxially grown III-V compound layers and a multiple quantum well structure for improved heat dissipation
Data Source
AI summary
A lighting device includes a plurality of light-emitting diodes including a first light-emitting diode with a non-rectangular shape in a top view, a submount to which each of the plurality of light-emitting diodes is coupled, and a plurality of conductive elements formed between the submount and the plurality of light-emitting diodes to electrically connecting at least a portion of the plurality of light-emitting diodes with each other in series.